Power Ground Plane Grid Hole Layout for Signal Resistance
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Solution Overview
Problem
Conventional circuit substrates with power/ground planes and grid holes suffer from increased resistance of power and ground signals, which compromises power integrity and generates excessive heat.
Innovation Solution
The design includes power/ground planes with grid lines that intersect to form grid holes, where the distance of the closest grid hole to the plane edge is more than 1.5 times the grid line width, and a second conductive layer with a projection layout and dielectric layer to reduce signal resistance and heat generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If grid holes are formed by etching copper power/ground planes to increase air dissipation and bonding strength, then reliability and structural integrity are improved, but the resistance of power signal and ground signal increases, compromising power integrity
Solution Approach 1:
The patent applies local quality by creating different regions within the power/ground planes: solid copper regions near the periphery for low resistance power/ground signals, and grid-pattern regions in the center for enhanced bonding strength and air dissipation. This spatial differentiation allows each region to optimize for its specific function.
Solution Approach 2:
The patent segments the power/ground planes into distinct functional zones: peripheral solid copper areas and central grid-pattern areas. This segmentation enables the structure to simultaneously achieve low resistance in power transmission paths and high bonding strength in mounting regions without compromising either property.
2Strength
If grid holes are evenly distributed across power/ground planes to increase air dissipation and bonding strength, then structural reliability is improved, but heat generation increases due to increased resistance
Solution Approach 1:
The patent implements local quality by restricting grid hole formation to specific central regions of the power/ground planes while maintaining solid copper in peripheral regions. This allows the structure to achieve high bonding strength where grid holes are present while minimizing heat generation by preserving continuous copper paths for power and ground signals.
Solution Approach 2:
The patent converts the potentially harmful effect of grid holes (increased resistance and heat generation) into a benefit by strategically positioning them only in regions where they provide bonding strength enhancement, while ensuring they do not interfere with primary power and ground signal transmission paths. The grid holes become beneficial structural features rather than harmful resistive elements.
Data Source
AI summary
The present invention relates to a circuit substrate having a first conductive layer. The first conductive layer includes at least one power/ground plane. The power/ground plane includes at least one plane edge and plurality of grid lines. Each grid line has a width. The grid lines intersect each other to define a plurality of first grid holes, wherein the distance between the first grid hole that is closest to the plane edge and the plane edge is 1.5 times the width. Thus, the influence on the resistance of power signal and ground signal caused by the first grid holes is reduced, power integrity is improved, and heat generation is reduced.