Adjustable Tuning Ring for Edge Uniformity Control
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Solution Overview
Problem
Substrate edge critical dimension uniformity issues in semiconductor processing due to electric field termination effects, leading to non-uniform deposition and etching rates across the substrate surface, particularly at the perimeter, which affects die yields.
Innovation Solution
A process kit for a substrate processing apparatus that includes an edge ring with an adjustable tuning ring beneath it, allowing for controlled gap adjustment via an actuating mechanism, which alters the capacitance and voltage applied to the edge ring, thereby controlling the plasma sheath and improving uniformity at the substrate edge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fixed deposition ring is used to control edge effects, then substrate edge uniformity is improved, but device complexity and adaptability are reduced
Solution Approach 1:
The patent applies the dynamics principle by making the tuning ring adjustable rather than fixed. The tuning ring can be positioned at different radial distances from the substrate center and at different vertical positions, allowing the system to adapt to different substrate sizes, shapes, and process requirements while maintaining edge uniformity control. This transforms a static structure into a dynamic, reconfigurable one.
Solution Approach 2:
The patent implements parameter changes by allowing the tuning ring parameters (radial position, vertical position, distance from substrate) to be varied. By changing these geometric parameters, the system can optimize edge uniformity for different substrate configurations and process conditions, thereby achieving both precision and adaptability.
2Manufacturing precision
If an adjustable tuning ring is added to control plasma sheath, then substrate edge uniformity is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by placing the tuning ring specifically at the substrate periphery where edge effects occur. Rather than making the entire deposition system adjustable, only the local edge-region tuning ring is made adjustable, allowing precise control of plasma sheath thickness at the critical edge regions while keeping the rest of the system simple and fixed.
3Manufacturing precision
If the tuning ring is positioned closer to the substrate, then plasma sheath control is improved, but risk of damage to the ring increases
Solution Approach 1:
The patent uses dynamics by allowing the tuning ring to be positioned at different vertical distances from the substrate. This enables the system to optimize the balance between plasma sheath control precision (requiring closer positioning) and ring durability (requiring greater distance), adapting the position based on specific process requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adjustable tuning ring enhances substrate edge uniformity by modifying the plasma sheath profile, reducing edge effects and improving die yields by allowing precise control over the plasma sheath thickness and ion direction, thus addressing the challenge of non-uniformity at the substrate perimeter.
Implementation Method 1
The lower surface is configured to interface with an actuating mechanism configured to move the adjustable tuning ring relative to the edge ring
Implementation Method 2
These non-uniformities at the perimeter may be attributable to electric field termination affects and are sometimes referred to as edge effects
Implementation Method 3
During processing, a substrate resting on a substrate support may undergo a process that deposits material on the substrate and to remove, or etch, portions of the material from the substrate
Data Source
AI summary
Embodiments described herein generally related to a substrate processing apparatus. In one embodiment, a process kit for a substrate processing chamber disclosed herein. The process kit includes an edge ring having a top surface and a bottom surface. An adjustable tuning ring is positioned beneath the bottom surface of the edge ring. The adjustable tuning ring has an upper surface and a lower surface. The lower surface is configured to interface with an actuating mechanism configured to move the adjustable tuning ring relative to the edge ring.