Adjustment Plate for Uniform Gas Distribution in Substrate Treating
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Solution Overview
Problem
In semiconductor device manufacturing, the asymmetric opening of the exhaust pipe in substrate treating apparatuses leads to non-uniform supply of process gas onto the substrate due to concentrated airflow, resulting in uneven gas distribution across the substrate.
Innovation Solution
The introduction of an adjustment plate within the chamber, featuring a cover plate with inclined and varying-sized holes or slits, strategically positioned between the outer and inner rings, interferes with the airflow to ensure uniform gas distribution by adjusting the exhaust flow across the chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the exhaust pipe is partially opened to adjust vacuum pressure, then the exhaust amount of process gas can be controlled, but asymmetric airflow is generated that concentrates process gas on a specific region
Solution Approach 1:
An adjustment plate is introduced as an intermediary component between the exhaust pipe and the chamber. This plate has an opening rate different from the exhaust pipe's opening rate, acting as a mediator to redistribute the airflow. The adjustment plate's opening is positioned to correspond with the exhaust pipe's opening, creating a buffer that transforms the asymmetric exhaust flow into a more uniform distribution across the chamber, thus maintaining manufacturing precision while allowing quantity control.
2Manufacturing precision
If the cover plate has holes or slits to interfere with airflow, then uniform gas distribution is achieved, but the device complexity increases
Solution Approach 1:
The adjustment plate is segmented into multiple functional elements: an outer ring, an inner ring, and a cover plate with multiple holes or slits. This segmentation allows each component to perform a specific function - the rings provide structural support and positioning, while the distributed holes/slits in the cover plate create multiple small airflow paths instead of one large opening. This segmentation achieves uniform gas distribution through multiple distributed openings while keeping each individual element relatively simple in design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration disperses the airflow uniformly across the substrate, ensuring consistent process gas supply and maintaining optimal internal pressure within the chamber, thereby enhancing process uniformity during operations like etching and deposition.
Implementation Method 1
an exhaust member connected to the exhaust pipe to provide a vacuum pressure to the exhaust pipe
Implementation Method 2
an adjustment plate having a cover plate which is provided in the chamber to interfere with a flow of the process gas in an internal region of the chamber
Data Source
AI summary
Provided is a substrate treating apparatus using a process gas and an adjustment plate used thereof. A substrate treating apparatus including a chamber providing a space in which a process is performed, a support member supporting a substrate in the chamber, a gas supply member supplying a process gas onto the substrate disposed on the support member, and an exhaust assembly coupled to the chamber to exhaust a gas in the chamber, wherein the exhaust assembly includes an exhaust pipe connected to the chamber, an exhaust member connected to the exhaust pipe to provide a vacuum pressure in the exhaust pipe, a valve adjusting an opening rate of the exhaust pipe, and an adjustment plate having a cover plate which is provided in the chamber to interfere with a flow of the process gas in an internal region of the chamber in a direction corresponding to, when the exhaust pipe is partially opened, an opened region of the exhaust pipe. Consequently, the process gas may be uniformly supplied onto the substrate.