Electronic Component Module Adsorption Face Member Height Reduction
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Solution Overview
Problem
Conventional electronic-component modules have a metal case or molded resin that increases the height and reduces the mountable area, hindering the miniaturization of electronic apparatuses due to the need for gaps and thickness, which is not necessary with improved electromagnetic shielding and adsorption functionality.
Innovation Solution
A method where an adsorption face member is positioned higher than the surface-mount devices and can be vaporized, liquefied, softened, or reduced in volume during reflow soldering to ensure efficient mounting and minimize the height of the electronic-component module, using materials like naphthalene or resins that change phase or shrink, allowing for automatic mounting and reshaping to match the height of the tallest surface-mount device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal case or molded resin is used to seal surface-mount devices, then electromagnetic shielding and device protection are improved, but the height of the electronic-component module increases
Solution Approach 1:
The patent extracts the sealing and electromagnetic shielding function from the traditional metal case structure. Instead of using a separate metal case that adds height, the invention integrates these functions into the adsorption face member itself, which is then removed after mounting. This eliminates the need for a permanent enclosing structure while maintaining protection during the critical mounting phase.
Solution Approach 2:
The adsorption face member performs the sealing and electromagnetic shielding function preliminarily during the mounting process. By providing temporary protection and shielding that is only needed during mounting, the invention avoids the need for a permanent structure that would increase module height. The member is removed after it has served its purpose, leaving a compact final assembly.
2Strength
If a metal case with thickness is used, then structural protection is improved, but the mountable area of the electronic-component base plate is reduced
Solution Approach 1:
The invention extracts the protective function from a permanent metal case structure and transfers it to a temporary adsorption face member. This member provides structural protection only during the mounting operation, after which it is removed. This approach maintains necessary protection during assembly while preserving the full mountable area for surface-mount devices, as no permanent structure occupies space on the base plate.
3Ease of operation
If a conventional electronic-component module structure is used, then adsorption functionality is ensured, but the height including gap and case thickness increases
Solution Approach 1:
The invention changes the physical state and dimensions of the adsorption face member dynamically. During mounting, the member maintains a sufficient thickness to provide an effective adsorption surface for the adsorption head. During subsequent heating (reflow soldering), the member undergoes phase change or decomposition, reducing its thickness to match or fall below the height of surface-mount devices. This parameter transformation allows the system to satisfy both adsorption requirements and height constraints at different stages.
Solution Approach 2:
The adsorption face member is designed to undergo phase transition during the reflow soldering process. The member is made of material that vaporizes, liquefies, softens, or decomposes at soldering temperatures. This phase change allows the member to transition from a solid structure providing adsorption functionality to a vapor or liquid state, effectively reducing its height contribution to zero or near-zero, thereby solving the height contradiction.
4Manufacturing precision
If gap between metal case and surface-mount devices is maintained, then manufacturing precision is improved, but the height of the module increases
Solution Approach 1:
The adsorption face member provides temporary spacing and positioning functionality during mounting, ensuring proper gap maintenance between the mounting surface and surface-mount devices. After mounting is complete and heating begins, the member vaporizes or decomposes, eliminating the need for permanent gap structures. This preliminary action approach maintains manufacturing precision during assembly without requiring permanent height-increasing features in the final product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient and certain mounting of electronic-component modules with reduced height and increased mountable area, improving productivity and miniaturization of electronic apparatuses by eliminating the need for additional steps and ensuring the adsorption face member is not higher than the surface-mount devices post-soldering.
Implementation Method 1
an adsorption face member 12 which is vaporized, liquefied, softened, or reduced in volume at the melting temperature of solder used in solder bonding
Implementation Method 2
an adsorption face member 12 which is vaporized, liquefied, softened, or reduced in volume at the melting temperature of solder used in solder bonding
Implementation Method 3
an adsorption face member 12 which is vaporized, liquefied, softened, or reduced in volume at the melting temperature of solder used in solder bonding
Data Source
Figure 1~2
Figure 3
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AI summary
The present invention provides a method for mounting an electronic-component module in which an adsorption head can adsorb and hold the electronic-component module, the electronic-component module can be efficiently mounted on a target board, and a height of the electronic-component module mounted on the target board can be sufficiently lowered and a method for manufacturing an electronic apparatus involving the method for mounting an electronic-component module, and an electronic-component module that can lower the height thereof. An adsorption face member 12 is provided on an electronic-component module 20 composed of an electronic-component base plate 1 and surface mount devices 2 (2a, 2b, 2c, 2d) mounted on the electronic-component base plate 1 in order to form an adsorption face 12a at a position that is substantially equal to or higher than that of an upper end of a transistor 2 (2c) that is the tallest surface-mount device. The adsorption head adsorbs the adsorption face to hold the electronic-component module and the electronic-component module is mounted on a motherboard 14 serving as the target board. Then a treatment is performed to prevent a situation in which an upper end of the adsorption face member is higher than the upper end of the tallest surface-mount device mounted on the electronic-component base plate.