Printed Circuit Assembling TRIZ Cases

Protrusions on flexible substrate bonding pads increase contact area with conductive particles, preventing collapse under high pressure.

Vaporizing the adsorption face member during reflow soldering eliminates height constraints from permanent shielding cases.

Interlayer connection pads bridge circuit layers through precise drilling and electroplating, overcoming alignment tolerance issues that degrade yield rates.

A bump structure uses a high-melting-point metal layer to contain solder members within narrow pitch gaps.

A non-adhesive pattern on a display film creates air paths to discharge trapped bubbles, preventing defects in touch sensing units.

A thermoplastic interposer merges structural support and thermal dissipation into a single laminate component.

A printed circuit board design uses non-plated holes to mechanically align components while preserving conductive trace integrity on the opposing face.

An air jet separates overlapping printed circuit boards during display manufacturing, preventing mechanical damage while enabling precise alignment.

Compressible conductors link battery electrodes to circuit boards, reducing pack height while maintaining electrical connectivity.

A conductive foil conveys electrical power through vias, eliminating additional power planes to reduce thickness and manufacturing complexity.

A thermally conductive heat distributor extends laterally beyond chip edges to facilitate heat conduction.

Segmented inspections detect open and short-circuit defects in conductor circuits during wiring substrate manufacturing.

A printed circuit substrate incorporates an intermetallic compound barrier layer to cover circuit patterns and suppress electrochemical migration.

A capacitance detection circuit uses a localized moisture absorption reduction area on the printed circuit board to maintain high insulation resistance.

A component mounter separates a workpiece holding body from a carrier to rotate multiple substrates simultaneously for precise alignment.

Insulation films isolate active layers on self-aligned nano-scale LEDs, preventing electrical short-circuits while enhancing light extraction efficiency.

Tin-silver-copper solder alloy with bismuth, indium, and germanium additions suppresses void formation and improves durability against cold thermal fatigue.

A bonding configuration joins facing wirings on electronic components using a conductive resin composition to establish electrical connections.

Casting substrate material onto a master surface creates a flexible sheet with a smooth circuit-side layer.

Inkjet deposition of metal particles forms fine probe bumps on a flexible resin layer, resolving uniform contact issues across varying terminal pitches.

A core-less magnetic sensor eliminates hysteresis and saturation effects in high-power drive applications while maintaining measurement precision.

Pre-coating ridge portions with conductive paste prevents solder leach and tombstone defects during mounting.

A flexible printed circuit board with stiffened end surfaces simplifies soldering operations in video endoscopes.

Asymmetric through electrode design reduces stress concentration at pad connections, improving joint strength and electrical reliability.

Adjustable guides on a supporter hold connection circuit boards between jigs, preventing compression and warpage to ensure secure attachment.

Generic lead frames supply selectable contact arrays to resolve labor-intensive manual loading errors in Advanced TCA connector manufacturing.

Forming terminals on electronic components prevents electrode damage during via formation, ensuring reliable electrical connections in embedded PCB structures.

A photocurable composition method uses a soluble gas atmosphere and a reversal layer to transfer fine concavo-convex patterns onto substrates.

An interface layer with land grid array pads decouples passive component distance from PCB line spacing variations.

Vertical thermal posts conduct heat away from circuit layers without occupying board space or degrading RF signals.

Control through wiring end face depth via electroplating to prevent gaps between wirings and inner walls, maintaining electrical connection reliability.

Rear mask supporting members prevent bending that causes paste deposits, reducing maintenance time and labor.

A compressible elastomeric interface seals the mold cavity and protects a flexible circuit pigtail from clamping forces during overmolding.

Segmented housing components interlock to hermetically seal electronics, balancing structural strength with form factor adaptability.

Lead-free solder encapsulates exposed electrical terminals on printed circuit boards through wave soldering processes.

Apertured ground plane restricts thermal conductivity to raise soldering site temperature, preventing improper soldering and component detachment.

Grooves between electrode sections and through holes block mechanical stress transmission to solder joints, preventing cracks during screw tightening.

A flexible display substrate manufacturing method uses a removable backing layer to ensure precise positioning and flatness during electronic component fabrication.

Photolithography forms conductive metal and polymeric elastomer layers on a ceramic board, reducing pad pitch adhesion and enabling 2-GHz signal response.

A self-tapping engagement element secures an electrical component to a printed circuit board.

A terminal electrode conductor with a longitudinal protrusion concentrates solder flow on end regions.

A connection structure extrudes a helically twisted yarn wire through a circuit board hole to form a protruding segment secured by elastic adhesive.

A mixed leadframe electrical connector combines standard and orthogonal contact tails to provide flexible signal routing options.

A support structure maintains consistent distance between laminated substrates in an electronic package.

An alumina ceramic chip mounted below the capacitor blocks piezoelectric vibrations, reducing acoustic noise levels to 37 dBA or less.

A dual-sided optoelectronic subassembly positions transducers and electrical components on opposite substrate faces to optimize RF line control.

Embedded metal members prevent insulating body warping during high-temperature soldering to maintain terminal contact.

An asymmetric conductive pad design distributes thermal shock across a bonding structure to prevent cracks in a rear-mounted semiconductor chip.

A touch sensor substrate uses linear projections and grooves to guide conductive powder particles into precise positions during thermocompression bonding.