Thermoplastic Interposer for PCB Thermal Management
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Solution Overview
Problem
Existing electronic device packaging using PCBs and metal frames results in bulky, heavy, and inefficient heat dissipation, leading to thermal management challenges in portable devices with high performance requirements.
Innovation Solution
A thermoplastic interposer with high molecular weight polymer layers is used to form a laminate structure with through vias and extensions for improved thermal conductivity and mechanical support, acting as a heat spreader and interconnect between PCBs, reducing the need for bulky metal frames and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If PCBs are mounted to metal frames and coupled with flex circuits, then structural stability is provided, but the device becomes bulky and heavy
Solution Approach 1:
The patent merges the structural support function and thermal management function into a single integrated thermoplastic interposer. The interposer combines mechanical support capabilities with high thermal conductivity pathways, eliminating the need for separate metal frames and flex circuit assemblies. This consolidation reduces overall device weight while maintaining structural stability and improving heat dissipation efficiency.
Solution Approach 2:
The patent employs composite material architecture within the thermoplastic interposer, combining thermoplastic matrices with thermally conductive fillers or integrated heat spreader materials. This composite approach enables the interposer to provide both mechanical support and efficient thermal management in a single lightweight component, replacing traditional heavy metal frame constructions.
2Strength
If PCBs are mounted to metal frames and coupled with flex circuits, then structural stability is provided, but the packaging becomes complicated and messy
Solution Approach 1:
The patent merges multiple discrete components (PCB support structure, thermal management system, and interconnect medium) into a single integrated thermoplastic interposer. This consolidation simplifies the packaging architecture from a multi-component assembly to a unified structure, reducing packaging complexity while maintaining all necessary functions.
Solution Approach 2:
The thermoplastic interposer serves multiple functions simultaneously: it provides mechanical support for PCBs, acts as a thermal management system through integrated heat spreader pathways, and serves as an interconnect medium between components. This multi-functionality eliminates the need for separate dedicated components for each function, thereby simplifying overall packaging.
3Strength
If traditional PCB and metal frame structures are used, then structural support is achieved, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent employs composite material architecture within the thermoplastic interposer, combining thermoplastic matrices with thermally conductive fillers or integrated heat spreader materials. This composite approach enables the interposer to provide both mechanical support and efficient thermal management in a single lightweight component, replacing traditional heavy metal frame constructions.
Solution Approach 2:
The thermoplastic interposer acts as an intermediary between heat-generating components and heat dissipation pathways. It provides direct thermal coupling and integrated heat spreader pathways that efficiently conduct heat away from critical components, improving thermal interface performance compared to traditional indirect cooling methods through separate metal frames.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermoplastic interposer effectively distributes and dissipates heat, reducing temperature differentials and enabling higher performance in compact, lightweight devices by providing improved thermal management and structural integrity.
Implementation Method 1
The interposer may include an ordered polymer... acting as a heat spreader... effectively distributes and dissipates heat
Data Source
AI summary
A thermoplastic interposer formed of ordered polymer sheets that may be configured to act as an interconnect and as a thermal energy spreader. In examples, the thermoplastic interposer may include one or more extensions or wings to further dissipate heat. In examples, laser direct structuring (LDS) may be used to form or more through silicon vias (TSVs) or through-chip vias. In examples, the ordered polymer sheets may be extruded via a roll-to-roll process, stacked, and processed to form a laminate interposer structure that makes up the interposer. In examples, the thermoplastic interposer may be used in multi-layer structures interconnecting two or more board assemblies such as printed circuit boards (PCB)s.