Wiring Substrate Dual-Stage Conduction Inspection
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Solution Overview
Problem
Existing methods for manufacturing wiring substrates lack comprehensive conduction inspections, particularly failing to reliably detect defects between conductor pads on both surfaces of the substrate, leading to potential defects in conductor circuits.
Innovation Solution
A method involving a first support plate with a metal foil, forming a wiring substrate with conductor pads on both surfaces, conducting a first conduction inspection before attaching a second support plate, and a second inspection after removing the metal foil to expose the first surface, allowing for thorough inspection of conduction between both sets of pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conduction inspection is performed only once before attaching the second support plate, then the inspection process is simple, but defects between conductor pads on both surfaces cannot be reliably detected
Solution Approach 1:
The inspection process is segmented into two distinct stages: first inspection before attaching the second support plate, and second inspection after removing the metal foil. This segmentation allows each inspection to focus on specific conductor pad connections that would otherwise be inaccessible or indistinguishable in a single inspection approach.
Solution Approach 2:
The first conduction inspection is performed preliminarily before attaching the second support plate, allowing detection of defects in conductor pads that will be covered later. This preliminary action ensures that defects are detected early when the structure allows access to all conductor pads.
2Reliability
If the metal foil is removed early to inspect first conductor pads, then the first surface can be inspected, but the wiring substrate cannot be properly supported during processing
Solution Approach 1:
The first conduction inspection is performed preliminarily while the metal foil is still attached, allowing inspection of conductor pads without removing the supporting metal foil structure. This eliminates the need for early removal and subsequent re-attachment processes.
Solution Approach 2:
The metal foil acts as an intermediary that provides structural support during the first inspection phase. By performing the inspection while the metal foil is still in place, the substrate maintains its structural integrity without requiring additional support mechanisms.
3Manufacturing precision
If only a single conduction inspection is performed, then the manufacturing process is efficient, but comprehensive quality control of both surfaces is compromised
Solution Approach 1:
The quality control process is segmented into two targeted inspections, each focusing on specific conductor pads at different stages of manufacturing. This segmentation ensures comprehensive coverage of both surfaces while maintaining process efficiency by inspecting only relevant areas at each stage.
Solution Approach 2:
The inspection process continues across two stages rather than being performed once and stopping. The first inspection checks conductor pads before the second support plate is attached, and the second inspection checks the remaining conductor pads after metal foil removal, ensuring continuous quality monitoring throughout manufacturing.
Data Source
AI summary
A method for manufacturing a wiring substrate includes preparing a first support plate having a metal foil formed on surface of a support substrate, forming a wiring substrate on the foil such that the wiring substrate has first surface facing the foil, attaching a second support plate to second surface of the wiring substrate, and separating the support substrate from the foil after attaching the second support plate such that the foil is removed from the first surface and that the first surface is exposed. The wiring substrate has first conductor pads on the first surface, and second conductor pads on the second surface, and the method includes conducting first inspection such that conduction between the second pads is inspected before attaching the second plate to the second surface, and conducting second inspection such that conduction between the first pads is inspected after removing the foil from the first surface.