Electronic Package Support Structure for Antenna Spacing
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Solution Overview
Problem
Conventional wireless communication modules face issues with inconsistent solder bump heights and co-planarity, leading to variable distances between antenna boards and circuit boards, which affects antenna signal transmission and product yield.
Innovation Solution
The electronic package involves a first substrate with a support layer, where a second substrate is laminated on top via the support, controlling the distance between the substrates without using soldering materials, ensuring consistent spacing and proper antenna function.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solder bumps are used to stack the antenna board on the circuit board, then the manufacturing process is simple, but the distance between the antenna board and circuit board varies due to poor co-planarity and height variations of solder bumps
Solution Approach 1:
The patent introduces a support structure as an intermediary component between the circuit board and antenna board. This support structure includes a first support portion extending from the circuit board and a second support portion extending from the antenna board, which work together to maintain a predetermined distance. The intermediary support structure eliminates the need to rely on solder bump co-planarity while still providing a simple manufacturing process.
Solution Approach 2:
The patent changes the parameter of distance control from being dependent on solder bump height variations to being determined by the predetermined length of the support structure. By fixing the distance parameter through the support structure's geometry rather than through soldering process control, the manufacturing precision is improved while maintaining ease of manufacture.
2Ease of manufacture
If solder bumps are used to connect the antenna board and circuit board, then the connection is straightforward, but unbalanced contact stress causes the antenna board to tilt
Solution Approach 1:
The support structure acts as a mediator that distributes the contact stress between the circuit board and antenna board. Instead of concentrating stress at discrete solder bump points, the support structure provides continuous mechanical support that maintains the antenna board's flatness and prevents tilting, while still allowing for straightforward assembly.
3Adaptability or versatility
If the distance between antenna board and circuit board is not controlled, then the manufacturing process is flexible, but antenna signal transmission quality deteriorates
Solution Approach 1:
The patent transforms the distance parameter from an uncontrolled variable to a controlled parameter by defining a predetermined distance through the support structure's geometry. This allows manufacturing flexibility to be maintained in other aspects while ensuring reliable antenna signal transmission through consistent distance control.
Data Source
AI summary
An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.