Conductive Foil Power Delivery for PCB Thickness Reduction
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Solution Overview
Problem
Existing methods for supplying electrical power to electronic modules on printed circuit boards often require additional power planes, increasing thickness and manufacturing complexity, and are not adaptable for post-manufacturing design changes.
Innovation Solution
A system that uses a conductive foil to convey electrical power from a voltage regulator to an electronic module through vias in the printed circuit board, eliminating the need for additional power planes and allowing for post-manufacturing modifications by adding the foil after the board is manufactured.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If additional power planes are added to the printed circuit board to supply electrical power to electronic modules, then the power delivery capability is improved, but the thickness and manufacturing complexity of the printed circuit board increase
Solution Approach 1:
The power delivery function is segmented from the printed circuit board structure itself. Instead of integrating power planes into the board layers, the patent uses separate conductive foils that are coupled to the board through vias. This segmentation allows the board to maintain its original simple structure while still achieving the required power delivery capability through external conductive elements.
Solution Approach 2:
Conductive foils serve as intermediary elements between the power source and the electronic modules. These foils are coupled to the printed circuit board through vias and provide the necessary power delivery without requiring the board itself to be modified with additional power planes. The intermediary foils resolve the conflict between power delivery requirements and board structural simplicity.
2Power
If the printed circuit board structure is modified to include additional power planes, then the power supply capability is improved, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The vias are pre-formed in the printed circuit board during the standard manufacturing process, creating ready-made connection points that can later accommodate conductive foils. This preliminary action allows the board to be manufactured using conventional processes without requiring complex modifications, while still enabling enhanced power delivery capability through the addition of foils in a subsequent step.
Solution Approach 2:
The power delivery system is made dynamic and adaptable. Instead of a fixed power plane structure that requires re-manufacturing the entire board for changes, the conductive foils can be added or modified independently after the board is manufactured. This dynamic approach improves ease of manufacture by allowing flexible design changes without costly board re-manufacturing.
3Ease of manufacture
If the printed circuit board is manufactured with fixed power planes, then the initial manufacturing is simplified, but post-manufacturing design changes become impossible
Solution Approach 1:
The power delivery system transitions from a static, fixed structure to a dynamic, modifiable one. The conductive foils can be added or reconfigured after the printed circuit board is manufactured, enabling design changes and adaptations without requiring the board itself to be re-manufactured. This maintains the simplicity of initial manufacturing while achieving high post-manufacturing flexibility.
Solution Approach 2:
The power delivery functionality is separated from the board structure, allowing independent modification. The vias provide fixed connection points that were established during initial manufacturing, while the conductive foils serve as separate, modifiable elements that can be changed later. This segmentation preserves both manufacturing simplicity and design adaptability.
4Power
If conventional power plane methods are used, then the power delivery path is direct, but the system is not compatible with incompatible power sources or post-manufacturing modifications
Solution Approach 1:
The conductive foils act as intermediary elements that can interface with different power sources and configurations. These foils are coupled to the board through vias but can be connected to various power sources externally, enabling compatibility with incompatible power sources while maintaining efficient power delivery to the electronic modules through the established via connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the thickness and manufacturing complexity of printed circuit boards by delivering power without additional planes and enables flexible design changes by allowing the conductive foil to be added later, supporting higher power delivery and compatibility with incompatible power sources.
Implementation Method 1
The conductive foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of the circuit board to at least the via that is electrically coupled to a contact location that receives electrical power for the electronic module
Data Source
AI summary
Power may be supplied to an electronic module according to various techniques. In one general implementation, for example, a system for supplying power to an electronic module may include a printed circuit board, the electronic module, and a conductive foil. The board may include a number of contact locations on a first side, with at least one of the contact locations electrically coupled to a via to a second side of the board. The electronic module may be electrically coupled to the contact locations on the first side of the board and receive electrical power through the at least one contact location electrically coupled to a via. The foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of circuit board to at least the via electrically coupled to a contact location that receives electrical power for the electronic module.