Direct Wiring Bonding for Electronic Components Assembly
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Solution Overview
Problem
Impedance mismatch in electrical connections between electronic components due to size differences in wiring and connection pads or lands, particularly evident in high-speed signal transmission, leading to reflection loss and impedance drops.
Innovation Solution
A bonding configuration where wirings on the surfaces of electronic components face each other and are bonded using an electric conductor, such as a resin composition with solder or conductive filler, without intermediate pads or lands, allowing for direct electrical and mechanical connection while minimizing impedance mismatch and enabling connections with narrow pitch without solder bridges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding methods with pads and lands are used, then electrical connection is achieved, but impedance mismatch occurs due to size differences between wiring and connection portions
Solution Approach 1:
The invention extracts and eliminates the intermediate connection structures (pads and lands) that cause impedance mismatch. By directly bonding wirings from opposing electronic components without these intermediate elements, the patent removes the source of impedance discontinuity while maintaining electrical connection functionality.
Solution Approach 2:
The invention merges the wiring structures of opposing electronic components by bringing them into direct contact. The wirings from first and second electronic components are bonded together, combining their functions into a single continuous conductive path that eliminates impedance mismatch at the connection interface.
2Reliability
If conventional bonding with pads and lands is used, then electrical connection is achieved, but connection pitch cannot be reduced due to solder bridge risks
Solution Approach 1:
The invention extracts and removes the large-area pads and lands that constrain minimum connection pitch. By eliminating these intermediate structures, the patent enables direct wiring-to-wiring bonding with significantly reduced pitch, limited only by the wiring dimensions themselves rather than pad/land sizes.
Solution Approach 2:
The invention changes the bonding interface parameters from large-area pad/land contacts to narrow wiring contacts. This parameter change in the bonding structure dimensions enables reduced connection pitch while maintaining reliable electrical connection, as the wiring width can be made much smaller than conventional pads or lands.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces impedance mismatch and allows for high-density, narrow-pitch connections with reduced solder usage, preventing solder bridges and ensuring reliable electrical and mechanical bonding between electronic components.
Implementation Method 1
a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween
Data Source
AI summary
The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler.