PCB Buildup Layer Terminal Formation for Reliable Connections
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Solution Overview
Problem
The manufacturing of printed circuit boards with embedded electronic components often results in defects in the arrangement of these components and damage to electrodes during via formation, leading to reliability issues in electrical connections.
Innovation Solution
A method involving the formation of terminals on electronic components using conductive paste or plating, followed by the creation of a buildup layer with insulating and circuit layers, which includes vias connected to the terminals, to ensure reliable electrical connections without damaging the electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vias are formed directly in the electrodes of electronic components to establish electrical connection, then electrical connectivity between buildup layer and electronic components is achieved, but the electrodes may be damaged causing reliability degradation
Solution Approach 1:
The patent introduces terminals as an intermediary element between the buildup layer and electronic components. Instead of forming vias directly in the electrodes, terminals are formed on the upper surface of the electronic component body and electrode, serving as a protective mediator that prevents direct mechanical damage to the electrode during via formation while still enabling electrical connectivity through the terminal structure
Solution Approach 2:
The patent applies preliminary action by forming terminals on the electronic component surface before mounting it in the substrate cavity. This preliminary terminal formation allows the subsequent via formation process to occur on the terminal surface rather than directly on the electrode, preventing electrode damage during the electrical connection establishment process
2Adaptability or versatility
If electronic components are embedded in inner layers of printed circuit board to achieve multi-functional and small package, then profile reduction and function integration are improved, but defects in arrangement and electrode damage may occur
Solution Approach 1:
The terminal structure enables self-service functionality where the electronic component's own upper surface is utilized as the mounting location for terminals. This eliminates the need for separate external connection structures and allows the component to serve its own electrical connection needs, improving integration while maintaining precision through the controlled terminal formation process
3Reliability
If terminals are formed on upper portion of electrode and body using conductive paste or plating, then electrical connection reliability is enhanced, but additional manufacturing steps are required
Solution Approach 1:
The terminal formation process serves multiple functions simultaneously: it creates the electrical connection interface, provides a protective barrier for the electrode, and establishes the mounting surface for subsequent via formation. This multi-functionality consolidates several potential separate processes into one integrated step, reducing overall manufacturing complexity despite the additional terminal formation operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the reliability of electrical connections between the buildup layer and electronic components, preventing electrode damage during the formation of vias and enabling effective electrical connectivity between embedded components.
Implementation Method 1
applying a conductive paste to the upper portion of the electrode of the electronic component and the upper portion of the body of the electronic component
Implementation Method 2
the terminals may be formed by a plating method
Implementation Method 3
The external terminals may be bonded to the upper portion of the electrode and the upper portion of the body by a welding method
Data Source
AI summary
Disclosed herein is a method of manufacturing a printed circuit board, including; forming an electronic component including an electrode that is formed on at least one side of a body; forming terminals on an upper portion of the electrode and an upper portion of the body; providing a substrate in which a cavity is formed; mounting the electronic component formed with the terminals in the cavity of the substrate; and forming a buildup layer on an upper portion of the substrate and an upper portion of the electronic component.