Orthogonal Thermal Posts for PCB Heat Dissipation
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Solution Overview
Problem
Conventional thermal management techniques for high-frequency applications, such as printed circuit boards (PCBs), face challenges with space occupancy, scalability, and thermal gradients due to the use of thermal vias and other methods that can affect radio frequency characteristics and long-term reliability.
Innovation Solution
A scalable thermal solution utilizing thermally-conductive posts that extend orthogonally from the PCB to a heat sink, eliminating the need for internal thermal vias and allowing for efficient heat transfer without occupying additional PCB space, thereby simplifying design and minimizing thermal gradients.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal vias are used to conduct heat through PCB, then heat dissipation is achieved, but space occupancy increases and scalability is limited
Solution Approach 1:
The patent transitions from in-plane heat conduction (thermal vias within PCB layers) to out-of-plane heat conduction by attaching thermal posts vertically above circuit elements. The thermal posts extend in the thickness direction of the PCB, conducting heat away from the circuit elements through a different spatial dimension, thereby eliminating the need for large thermal via openings in the PCB plane.
Solution Approach 2:
The thermal conduction function is extracted from the PCB structure itself and transferred to separate thermal posts. Instead of relying on thermal vias embedded within the PCB, the patent uses standalone thermal posts that can be attached to the PCB surface, separating the heat conduction path from the PCB's internal via structure.
2Adaptability or versatility
If PCB thickness is increased to accommodate more circuit layers, then circuit capacity increases, but thermal via size must increase which further increases space occupancy
Solution Approach 1:
The patent addresses the contradiction by moving heat conduction to the vertical dimension through thermal posts. As PCB thickness increases to accommodate more circuit layers, the thermal posts extend proportionally in the thickness direction, providing adequate heat conduction paths without requiring increased via footprints in the PCB plane, thus maintaining high circuit capacity while controlling space occupancy.
3Temperature
If thermal vias are used for heat removal, then heat dissipation is achieved, but thermal gradients are induced and design complexity increases
Solution Approach 1:
The patent extracts the thermal management function from the complex via structure and implements it through simple thermal posts. The thermal posts provide direct heat conduction paths from circuit elements to heat sinks without requiring complex via networks, thermal pads, or multiple layers of thermal vias, thereby significantly reducing design complexity while maintaining effective heat dissipation.
4Temperature
If conventional thermal management techniques are used, then heat dissipation is achieved, but RF characteristics and long-term reliability may be affected
Solution Approach 1:
The patent extracts the thermal conduction function from the PCB's electrical signal paths by using separate thermal posts that do not interfere with RF circuitry. The thermal posts are positioned to conduct heat away from circuit elements without creating parasitic electrical connections or altering RF characteristics, thereby maintaining both heat dissipation effectiveness and signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides effective heat dissipation, supports scalability, reduces design complexity, and maintains low costs by eliminating the need for internal cooling features, while maintaining RF characteristics and long-term reliability.
Implementation Method 1
a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path
Data Source
AI summary
An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.