Laterally-Conducting Heat Distributor for Electronic Module Thermal Management
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Solution Overview
Problem
Current cooling mechanisms for electronic modules, such as stacked multichip modules, are limited by top-down heat dissipation approaches that restrict the effective cooling area to the top surface of the chip, necessitating more effective heat management as chip power increases.
Innovation Solution
Incorporating a thermally conductive heat distributor within the underfill layer between the chip and substrate, which extends laterally beyond the chip edge to facilitate heat conduction to the thermally conductive enclosure, allowing heat to be dissipated laterally and upwardly through the enclosure, while maintaining electrical isolation from the electrical connect structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat sinks are used to dissipate heat from electronic components, then heat dissipation is achieved through top surface cooling, but the cooling area is restricted and thermal performance is limited
Solution Approach 1:
The patent transitions from single-direction (top surface) heat dissipation to multi-directional heat dissipation by extending heat conduction pathways laterally through the substrate. The heat distributor layer conducts heat laterally beyond the chip edges, and heat sinks positioned at the substrate periphery provide additional cooling surfaces, effectively utilizing three-dimensional heat transfer pathways.
Solution Approach 2:
The heat dissipation system is segmented into multiple independent heat sinks positioned at different locations around the substrate periphery. Each heat sink independently dissipates heat laterally conducted to it, distributing the thermal management function across multiple discrete elements rather than relying on a single top surface heat sink.
2Temperature
If heat is conducted laterally through the substrate to peripheral heat sinks, then cooling efficiency is improved, but electrical isolation must be maintained between heat conduction pathways and electrical connect structures
Solution Approach 1:
The patent introduces a thermally conductive but electrically isolating intermediary layer or structure between the lateral heat conduction pathways and the electrical connect structures. This intermediary enables thermal energy transfer while blocking electrical current, resolving the conflict between heat conduction and electrical isolation requirements.
Solution Approach 2:
The substrate or heat distributor layer exhibits different material properties in different regions: high thermal conductivity for lateral heat conduction away from the chip, and electrical isolation properties where it interfaces with electrical connect structures. This spatial variation in material properties allows simultaneous heat conduction and electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal performance by providing alternate heat conduction pathways, effectively cooling the chip and potentially lowering chip temperatures, even in stacked configurations, without requiring upper-level chips to conduct heat to a heat sink.
Implementation Method 1
The heat distributor, which is disposed between the first component and the second component, comprises a thermally conductive material and extends laterally beyond an edge of at least the first component to facilitate conduction of heat laterally out from between the first component and the second component
Implementation Method 2
The heat distributor, which includes a plurality of openings sized and positioned to allow the plurality of electrical connect structures to pass therethrough without electrically contacting the heat distributor, is electrically isolated from the plurality of electrical connect structures
Data Source
AI summary
An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure.