Pneumatic PCB Separation for Display Manufacturing
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Solution Overview
Problem
The manufacturing process of display devices often results in damage to printed circuit boards, which is not effectively addressed by existing technologies.
Innovation Solution
A manufacturing method and apparatus that involves loading a panel assembly with overlapping printed circuit boards, using a jet of air to raise the second printed circuit board away from the first, pre-processing the exposed end of the first printed circuit board, and aligning the distal ends of both boards for electrical connection and laser marking, thereby minimizing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If printed circuit boards are overlapped during manufacturing, then assembly is facilitated, but damage to the printed circuit boards occurs
Solution Approach 1:
A jet of air is introduced as an intermediary between the first and second printed circuit boards to separate them. The air jet applies upward force on the second PCB, creating a gap that prevents direct contact and potential damage while allowing the boards to remain in their overlapping assembled position. This mediator approach enables easy assembly through overlapping while eliminating the harmful contact that causes damage.
Solution Approach 2:
The invention utilizes pneumatic pressure through a jet of air to achieve separation of the printed circuit boards. The air jet is directed at the interface between the first and second PCBs, using gas pressure to lift and separate the boards. This pneumatic approach provides a non-contact method to prevent damage while maintaining the assembled configuration.
2Object-affected harmful factors
If printed circuit boards are separated to prevent damage, then damage is reduced, but alignment precision becomes difficult to achieve
Solution Approach 1:
The system dynamically adjusts the separation between the printed circuit boards by controlling the air jet. The boards can be in contact during alignment operations requiring precision, then dynamically separated when damage prevention is needed. This dynamic control allows the system to switch between states of contact (for precision) and separation (for damage prevention) as required by different manufacturing stages.
Solution Approach 2:
The invention changes the parameter of inter-PCB distance from zero (contact) to a positive value (separation) by controlling air jet activation. When alignment precision is needed, the air jet is deactivated and boards remain in contact. When damage prevention is needed, the air jet activates to create separation. This parameter change enables the system to achieve both precision and damage reduction at different stages.
3Ease of operation
If mechanical contact is used to separate printed circuit boards, then separation is achieved, but additional damage risk increases
Solution Approach 1:
The invention replaces mechanical contact-based separation systems with a pneumatic system. Instead of using mechanical tools or fixtures that physically touch and potentially damage the PCBs, an air jet is used to provide separation force. This substitution eliminates the need for mechanical contact during separation operations, thereby removing the associated damage risk while maintaining ease of operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces or prevents damage to printed circuit boards during the manufacturing process by using air to separate and align the boards, allowing for precise pre-processing and connection without causing harm.
Implementation Method 1
providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion of the second printed circuit board away from the end portion of the first printed circuit board
Data Source
AI summary
A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.