Multi-part Flexible Encapsulation Housing for Conformal Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional integrated circuits (ICs) and printed circuit boards (PCBs) are rigid, making them incompatible with applications requiring stretchable or bendable electronics, and existing methods for creating flexible circuits are often thick and costly due to the use of multiple layers of expensive materials.
Innovation Solution
The development of conformal electronics with encapsulated IC device islands on flexible substrates, using a multi-part encapsulation housing that hermetically seals the electronic circuitry and interconnects, allowing for thin, flexible, and stretchable conformal sensors that can be mounted on body parts or objects for physiological monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a single-piece rigid housing is used, then structural strength is improved, but adaptability to different form factors and flexibility are worsened
Solution Approach 1:
The housing is divided into multiple separate pieces (first housing piece and second housing piece) that can be independently formed and then joined together. This segmentation allows each piece to be optimized for specific structural requirements while the overall assembly provides adaptability to different form factors through selective joining of components.
2Ease of manufacture
If a single-piece housing is used, then manufacturing simplicity is improved, but device complexity increases due to assembly requirements
Solution Approach 1:
Dividing the housing into multiple pieces enables each component to be manufactured using optimized processes suitable for its specific geometry and material requirements, potentially reducing overall manufacturing complexity despite requiring assembly of multiple parts.
Solution Approach 2:
The use of adhesive as an intermediary joining method simplifies the assembly process compared to mechanical fasteners or welding, allowing the multiple housing pieces to be joined through a straightforward bonding process that reduces assembly complexity.
3Strength
If rigid materials are used for the housing, then structural strength is improved, but impact resistance and flexibility are worsened
Solution Approach 1:
The housing employs composite construction by joining multiple pieces made of rigid materials with adhesive bonding. This composite structure maintains the structural strength benefits of rigid materials while the bonded joint configuration and potential use of flexible adhesives provide improved impact resistance and flexibility compared to monolithic rigid housings.
Data Source
Figure 1~2
Figure 3A~3B
Figure 4A~4B
AI summary
Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.