Multilayer Substrate Interlayer Connection Pad Alignment Tolerance
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Solution Overview
Problem
Existing methods for manufacturing multilayer substrate structures face challenges due to alignment tolerance issues, leading to circuit pattern deviation and increased width requirements for compensation, which affects the yield rate and density of circuitry.
Innovation Solution
A method involving pre-treatment, pressing, and post-treatment steps to form interlayer connection pads between circuit pattern layers, ensuring indirect electrical connections and overcoming alignment tolerance by embedding and drilling with precise control to maintain finer line widths and smaller pitches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the seed layers are removed by etching after forming circuit patterns, then the circuit patterns can be transferred to the substrate, but part of the circuit patterns are possibly removed at the same time, requiring increased width for circuit compensation
Solution Approach 1:
The patent forms interlayer connection pads in advance before the etching process. These pads are created on the substrate surface prior to removing the seed layers, ensuring that even if some circuit pattern material is lost during etching, the connection pads remain intact and provide reliable electrical connections. This preliminary formation of connection structures protects against yield loss from pattern degradation.
Solution Approach 2:
The interlayer connection pads serve as intermediary structures between the circuit patterns and the substrate. Rather than relying directly on the etched circuit patterns for all connections, the pads act as a buffer zone that compensates for pattern loss during etching. The pads are formed with sufficient width to ensure that alignment tolerances and etching variations do not compromise the electrical connection.
2Manufacturing precision
If the width of circuit patterns is increased for compensation, then alignment tolerance is overcome, but the density of circuitry is reduced
Solution Approach 1:
The patent segments the connection function from the circuit pattern function. Instead of requiring the entire circuit pattern to be wide enough to accommodate alignment variations, the connection function is separated into dedicated interlayer connection pads. These pads can be optimally sized for alignment tolerance, while the circuit patterns themselves can maintain their intended narrow widths for high density.
Solution Approach 2:
The patent introduces an additional dimensional element by forming connection pads that extend beyond the circuit pattern boundaries. The pads are formed with width specifically designed to overcome alignment tolerance issues, while the circuit patterns maintain their original narrow dimensions. This dimensional separation allows the connection structures to be wider without forcing the circuit patterns to be wider.
3Reliability
If drilling is performed through the connection pad to form openings, then electrical connections can be established, but alignment tolerance may cause the opening to penetrate through the plastic sheet
Solution Approach 1:
The patent designs the interlayer connection pads with sufficient width to act as a cushion or buffer zone. This preliminary design ensures that even if drilling alignment has some variation, the drill bit remains within the pad boundaries and does not penetrate into the plastic sheet. The extra width provides a margin of safety that compensates for alignment tolerances during the drilling process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of multilayer substrate structures with finer lines and denser circuitry by providing intentional interlayer connection pads that are wider than alignment tolerance, thereby improving yield rates and reducing circuit pattern deviations.
Implementation Method 1
a substrate 10 is provided with two seed layers 20 on the upper and lower surfaces by electroplating, respectively
Implementation Method 2
the opening 100 and the central region 40 are filled with metal by electroplating such that the first circuit pattern 31 is electrically connected to the second circuit pattern layer 32
Data Source
AI summary
A method of manufacturing a multilayer substrate structure includes the steps of pre-treatment, pressing and post-treatment. A carrier plate provided with a circuit pattern layer is pressed against a plastic sheet. An interlayer connection pad is formed by drilling and filling the lower surface of the plastic sheet. The carrier plate, the plastic sheet, another plastic sheet and another carrier plate with a circuit pattern layer are pressed together, and then drilled/filled to form a multilayer stacked structure such that the two circuit pattern layers are indirectly and electrically connected to the interlayer connection pad, respectively. Therefore, it is possible to overcome the problem due to alignment tolerance by using the interlayer connection pad wider than alignment tolerance, and stacking the circuit layers, each having much finer line and smaller pitch.