Semiconductor Package Adsorption Pad Silicon Oil Stiction Prevention
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Solution Overview
Problem
Conventional test apparatuses for package-on-package semiconductor packages face issues with the sticky phenomenon, where the semiconductor package sticks to the adsorption pad due to silicon oil elution, leading to reliability concerns and inefficient testing processes.
Innovation Solution
The test apparatus incorporates an adsorption pad with a silicon body part and a stiction-preventing adsorption part made of polyimide film, engineering plastic, or synthetic resin, featuring an adsorption hole and oil overflow-preventing parts to trap eluted silicon oil, preventing the semiconductor package from sticking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the adsorption pad is made of silicon material to protect the semiconductor package and increase vacuum adsorption performance, then the adsorption performance is improved, but the sticky phenomenon occurs due to silicon oil elution
Solution Approach 1:
The adsorption pad is divided into two distinct parts: a silicon body part for vacuum adsorption and a stiction-preventing adsorption part made of non-stick material. This segmentation allows each part to fulfill its specific function without causing harmful effects - the silicon part provides adsorption performance while the non-stick part prevents the sticky phenomenon.
Solution Approach 2:
Different materials are used in different regions of the adsorption pad. The body part uses silicon for vacuum adsorption performance, while the adsorption part that contacts the semiconductor package uses non-stick material (polyimide film, engineering plastic, or synthetic resin) to prevent sticking. This local quality differentiation resolves the contradiction between adsorption performance and stick prevention.
2Duration of action of moving object
If the adsorption pad contacts the semiconductor package for a long time (1-2 weeks for reliability tests), then the testing duration is extended, but silicon oil accumulates and causes the sticky phenomenon
Solution Approach 1:
The adsorption part is designed as a replaceable component that can be easily replaced after accumulating silicon oil during long-term testing. This allows the main silicon body part to be reused for extended testing durations while the disposable adsorption part prevents sticking by being replaced rather than cleaned, resolving the contradiction between long testing duration and stick prevention.
3Object-generated harmful factors
If an antistatic coating or special coating is applied on the adsorption pad surface to prevent sticking, then the sticky phenomenon is addressed, but the solution is insufficient and sticking still occurs
Solution Approach 1:
Instead of applying coatings that prove insufficient, the invention changes the fundamental material parameter of the adsorption part from silicon to non-stick materials (polyimide film, engineering plastic, or synthetic resin). This parameter change fundamentally eliminates the silicon oil elution problem while maintaining vacuum adsorption functionality through the body part, achieving reliable prevention of the sticky phenomenon.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents the sticky phenomenon, allowing for precise and efficient testing of package-on-package semiconductor packages, enabling easy unloading and loading of tested packages, thus enhancing the overall testing process.
Implementation Method 1
an adsorption pad movably coupled to the pusher and configured to adsorb and pressurize the lower package using a vacuum pressure provided through the pusher
Data Source
AI summary
An apparatus for testing a package-on-package type semiconductor package includes an upper test socket on which an upper package is mounted, the upper test socket being mounted on a pusher and connected to the lower package; a lower test socket mounted on a tester and connected to the lower package; and an adsorption pad coupled to the pusher and configured to adsorb and pressurize the lower package using a vacuum pressure, wherein the adsorption pad comprises a body part having a vacuum pressure passage formed therein; and an adsorption part having an adsorption hole corresponding to the vacuum pressure passage, and the body part is attached on a central portion of an upper surface of the adsorption part and an outer oil overflow-preventing part configured to trap silicon oil eluted from the body part is formed at an outer periphery the adsorption part.