Multilayer Antenna-in-Package Substrate for Tunable Radiation Control
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Solution Overview
Problem
Conventional antenna in package (AIP) solutions using organic substrates face challenges such as non-tunable antenna to ground plane distance, difficulty in implementing air-core or high dielectric-constant cores, compromised transmission line performance due to large via structures, and delamination risks from moisture absorbent materials.
Innovation Solution
The proposed AIP solution incorporates a multilevel package substrate with an antenna on the top metal layer, allowing for tunable antenna performance and integration of low dielectric constant materials for enhanced antenna performance. This design also includes an optional air gap between the antenna feed and the antenna for improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional organic substrate is used for AIP, then routing complexity requirement is met, but antenna to ground plane distance cannot be tuned and radiation pattern control is limited
Solution Approach 1:
The package substrate is divided into multiple layers with distinct functions: signal layer, ground layer, and intermediate dielectric layers. This segmentation allows independent optimization of each layer, enabling tunable antenna-to-ground-plane distance through selection of specific dielectric layers while maintaining routing complexity requirements.
Solution Approach 2:
The invention transitions from a conventional single-layer organic substrate to a multilayer package substrate architecture. By adding the vertical dimension with multiple dielectric layers and metal traces, the design enables adjustment of antenna-to-ground-plane distance without increasing lateral complexity, thus improving adaptability while controlling device complexity.
2Reliability
If conventional organic substrate is used for AIP, then package can be manufactured, but delamination risk increases due to moisture absorption
Solution Approach 1:
The package substrate employs a composite structure combining multiple dielectric layers with different properties. The first dielectric layer and second dielectric layer are selected with complementary characteristics to provide both mechanical integrity and moisture barrier properties, reducing delamination risk while maintaining manufacturability through established multilayer PCB fabrication processes.
3Loss of energy
If air-core is implemented for antenna, then radiation loss is reduced, but package thickness increases
Solution Approach 1:
The invention implements an air-core structure only in the specific region where the antenna trace is located, rather than making the entire package substrate air-core. This localized approach reduces radiation loss at the antenna position while maintaining adequate package thickness through the dielectric layers in other regions, thus resolving the contradiction between energy efficiency and compact form factor.
4Length of stationary object
If high dielectric-constant core is used for antenna, then package thickness is reduced, but radiation pattern performance deteriorates
Solution Approach 1:
The package substrate uses different dielectric layers with optimized properties for different functions: the first dielectric layer provides mechanical support and moisture protection, while the second dielectric layer is specifically optimized with appropriate dielectric constant for antenna performance. This local optimization allows reduced package thickness while maintaining radiation pattern performance through careful material selection in the antenna region.
Data Source
AI summary
An antenna in package (AIP) 400 includes an IC die 120 including bond pads 121 and a package substrate including the IC die mounted up and being completely embedded therein. The package substrate includes a top layer 418 including a top dielectric layer 418b, a top metal layer 418a including an antenna 418a1, and a bottom layer 415 including a bottom dielectric 415b and a bottom metal layer 415a including contact pads including a first contact pad 415a1, and filled vias 415c, 417c. The bond pads are electrically coupled by a connection including a filled via(s) for connecting to the top metal layer and/or the bottom metal layer. Metal pillars including a first metal pillar 132a are electrically are coupled to the first contact pad, and at least one filled via is electrically coupled to the first metal pillar for providing a transmission line from the first contact pad to the antenna.