Air Vent Portions in Semiconductor Molding Die Cavities
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Solution Overview
Problem
Existing semiconductor device manufacturing methods face challenges in suppressing void formation and resin seal failures during the molding step, leading to reliability issues and reduced mounting strength.
Innovation Solution
A lead frame with strategically positioned air vent portions is used to discharge gas from the cavity, where these air vent portions are extended along the sides of the clamp area and overlap with corner portions of the cavity, ensuring effective gas discharge and resin distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a groove portion is formed in the dam portion to create a large volumetric capacity hollow space, then gas discharge is improved, but resin leak occurs because the outside of the dam portion becomes an open space
Solution Approach 1:
The air vent portion is positioned specifically at the corner portions of the cavity where gas accumulates, rather than creating a large open space. This localized approach allows effective gas discharge while maintaining resin containment through the dam portion's structure.
Solution Approach 2:
The air vent portion is divided into multiple segments located at different corner portions of the cavity. This segmentation allows gas to be discharged from multiple locations simultaneously, improving discharge efficiency without requiring a single large open space that would cause resin leakage.
2Object-generated harmful factors
If the volumetric capacity of the hollow space formed by the groove portion is reduced, then resin leak is prevented, but void formation occurs
Solution Approach 1:
Instead of relying on a single large hollow space, the air vent system is segmented into multiple smaller portions at different corner locations. This allows gas to escape from multiple points, preventing void formation without requiring a large volumetric capacity that would cause resin leakage.
Solution Approach 2:
The air vent portions are positioned at corner portions where gas naturally accumulates during molding. This preliminary positioning of discharge paths at critical locations prevents gas entrapment and void formation before the molding process completes, without needing excessive hollow space.
3Reliability
If air vent portions are positioned at corner portions of the cavity, then gas discharge efficiency is improved, but the lead frame structure becomes more complex
Solution Approach 1:
The air vent portions are integrated into the existing lead frame structure at specific corner locations rather than adding a separate complex system. This localized integration achieves effective gas discharge while minimizing structural complexity by utilizing the lead frame's inherent geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses resin seal failures, enhances the mounting strength of semiconductor devices by ensuring complete resin filling and preventing voids, thereby improving the reliability and quality of the semiconductor device.
Implementation Method 1
multiple air vent portions are formed in the lead frame for discharging gas in a cavity formed in an upper die of a molding die to outside the cavity
Data Source
AI summary
The occurrence of a resin seal failure is suppressed. A molding step is carried out using a lead frame in which there are formed multiple air vent portions for discharging gas in each cavity formed in the upper die of a molding die to outside the cavity. The air vent portions are formed at positions overlapping with the other corner portions, arranged inside a gate portion of the cavity. Each of the air vent portions is led out from the other corner portions of the cavity to outside a clamp area and is extended along sides of the cavity, respectively, in the clamp area.