Aircraft Electronic Card With Offset Insulating Layers
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Solution Overview
Problem
Existing electronic cards in aircraft on-board equipment face challenges in achieving effective heat dissipation while maintaining sufficient galvanic insulation, leading to potential overheating issues.
Innovation Solution
The electronic card design features two superposed conductive layers with offset insulating portions, allowing closer alignment of conductive portions for improved heat transfer between layers without compromising galvanic insulation, thereby enhancing heat dissipation through conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulating portions are superposed in the same zone to ensure galvanic insulation, then electrical insulation is improved, but heat dissipation deteriorates due to the heat-barrier effect
Solution Approach 1:
The patent applies dimensional offsetting by shifting insulating portions horizontally between layers rather than stacking them vertically in the same zone. This transforms the vertical heat conduction path into a path that bypasses the insulating portions laterally, allowing heat to dissipate through conductive portions while maintaining galvanic insulation through the offset insulating structure.
Solution Approach 2:
The patent segments the insulating portions and conductive portions into offset positions across layers. By dividing the insulating function into multiple offset segments rather than a single superposed barrier, heat can pass through gaps between insulating portions via conductive paths, while electrical insulation is maintained at each segmented interface.
2Temperature
If conductive portions are brought closer together to improve heat dissipation, then heat transfer is improved, but galvanic insulation deteriorates
Solution Approach 1:
The patent applies local quality by creating spatially varying properties: in some zones conductive portions are close together to facilitate heat dissipation, while in offset zones insulating portions provide galvanic insulation. Each local region has optimized properties for its specific function, allowing the overall system to achieve both heat dissipation and electrical insulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces thermal resistance and prevents overheating, increasing the reliability of electronic equipment by facilitating efficient heat evacuation while maintaining galvanic insulation, even in impermeable compartments.
Implementation Method 1
heat transfer by conduction therefore can take place between these portions from one layer to the other
Implementation Method 2
the insulating portions (poor heat conductors) are no longer superposed, the heat-barrier effect associated with stacking of these insulating portions
Data Source
AI summary
An electronic card that includes at least two superimposed conducting layers with an insulation layer between the two conducting layers, the two conducting layers each including a utility conducting portion and a conducting portion at the periphery of the utility conducting portion with an insulating portion between the conducting portions, the insulating portion of a first of the two layers being offset relative to the insulating portion of the second of the layers. An aircraft includes a housing in which at least one such card is provided.