Printed Electric Component Incorporation TRIZ Cases

A conductive joint column extends through a solder mask layer to create a dedicated bonding surface.

A printed board recess creates a thermal pathway between components and conductive layers.

A laminate current sensing device uses a voltage sensing via to measure the voltage drop across an inner layer resistive element.

A warpage-proof circuit board structure integrates protruding metal frames within dielectric and solder mask grooves to reinforce the substrate.

High molecular weight acrylic rubber and phosphorus-containing ester resolve stress relief contradictions, achieving 6 N/cm adhesion.

A silicon core circuit wiring board integrates a built-up wiring layer to enable fine pitch interconnects.

Cavities in the flexible substrate house pre-assembled units, resolving rigidity issues while enabling efficient thermal dissipation.

A metal core printed circuit board embeds optical components in cavities with thermal vias for efficient heat dissipation.

A wiring substrate integrates recessed and flush electroless Ni/Pd/Au plating layers on conductor pads to eliminate solder bump formation steps.

An integrated smart label merges visual barcodes with embedded RFID components into a single substrate for unified identification.

A wiring substrate uses a dual insulating layer system to fill component cavities and prevent surface dishing during manufacturing.

Rectilinear contact array alternates transmitter and receiver pairs with ground contacts to reduce cross-talk jitter.

Nickel barrier plating stabilizes copper layer heights in printed circuit board heat dissipation structures.

Doped semiconductor resistance units in display fan out lines compensate for non-uniform lengths, eliminating signal delay and display defects.

A via-free printed circuit board design featuring recessed and protruding portions for direct chip connections.

Guide holes in the metal layer expose electrodes, allowing CO2 laser ablation to self-align vias and increase contact area despite component miniaturization.

A multilayer printed wiring board uses selective etching to form flat plane conductors within resin insulative layers.

Dielectric projection covers shorter wiring conductors to slow signal propagation and reduce phase differences in electronic component housing packages.

Segmented conductive layers with varying thickness alleviate thermal expansion stress, preventing insulating layer cracking and improving capacitor reliability.

Varying through-hole diameters relative to lead pins prevents premature solder solidification caused by heat escape through broad conductor patterns.

A via hole conductor features a protrusion extending from its circular connection surface to maintain electrical contact with line conductors.

A multi-layer circuit board structure forms a ground path surrounding a signal path to enhance signal loop integrity.

Embedding-dedicated boards standardize mounting for electronic components of varying thicknesses in multi-layer wiring structures.

Offset insulating portions in superposed conductive layers reduce thermal resistance while maintaining galvanic insulation for aircraft electronic cards.

Concave-convex portions on the PCB base substrate increase adhesive contact area to resolve low shear strength in conventional chip mounting methods.

Openings in the non-overlapping electrode lower baseline capacitance, resolving sensitivity inconsistency by maximizing the measurable change ratio.

Embedding an RFID tag inside the memory module substrate prevents label detachment, securing product identification against theft.

Convex quadrilateral solder ball arrangements balance electromagnetic coupling fields in BGA packages, reducing cross-talk noise between differential signals.

Resistors in the ground trace convert electrical energy into heat, reducing signal noise caused by impedance mismatches.

Relocating scan lines to the substrate backside eliminates front surface obstructions, restoring the aperture ratio for higher image quality.

A flexible appliance with orthogonally oriented resilient connectors bridges electronic interfaces across substrates.

Direct joining of a flexible antenna to a rigid member via ultrasonic heating eliminates adhesive layers that cause dimensional misalignment.

Merging display and keypad assemblies eliminates flexible printed circuits, reducing mobile terminal thickness and fabrication costs.

Alternating ground and power via grids cancel induced electromotive forces, reducing loop inductance to prevent high-frequency IC malfunction.

Straight conductors link opposite-side contacts through a substrate, reducing circuit board complexity while preserving signal integrity.

An optoelectronic device uses an anisotropic conductive adhesive to electrically connect substrates while maintaining mechanical stability.

Thermal interface material conducts heat from power converter components to the motherboard, eliminating heavy baseplates and forced airflow requirements.

A pre-patterned substrate featuring interdigitated line structures guides inkjet deposition to form precise electronic components on flexible media.

Insulated bonding regions in a semiconductor package isolate voltage levels to mitigate crosstalk and interference during high-frequency operations.

Optimized indium and bismuth content in the solder alloy promotes rapid Cu-Sn intermetallic growth, blocking cleavage paths during thermal cycling.

Rougher resin surfaces increase mechanical interlocking between the plating layer and columnar conductors, preventing peeling under thermal stress.

Build-up layers with controlled plating thicknesses reduce warpage and improve connection reliability under thermal stress.

A thermoresponsive composite element uses LCST polymers to embed silver nanowire traces for stable electrical conductance in warm conditions.

A flexible tape substrate with an adhesiveless metal layer uses electro-deposited metal to plug punched holes and increase layer thickness.

Surface connection patterns bridge embedded capacitor electrodes and terminal groups, resolving precision trade-offs while maintaining compact packaging.

Vertical metallic pin headers on a printed substrate boost gain patterns while reducing board space usage for massive MIMO systems.

An upright laminated PTC device withstands 60 to 600 volts by preventing solder wicking through perpendicular electrode orientation.

A wiring board uses an interposer to mount semiconductor elements with varying pitches, reducing board size while mitigating stress-related cracks.

An adhesive layer with an intermediate coefficient of thermal expansion bonds a base substrate to a wiring board in a multichip module.

Segmented metal terminals separate wire bonding from solder mounting, resolving adhesion conflicts during miniaturization.