Laminate Current Sensing Device with Voltage Sensing Via

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Solution Overview

Problem

Conventional current sensing devices with substrate-mounted resistors lack an effective voltage sensing structure and improved current sensing accuracy.

Innovation Solution

A current sensing device with a laminate structure, including a current sensing element, current wire, current vias, and a voltage sensing via that connects to the current sensing element to enhance current sensing accuracy, where the voltage sensing via is positioned to overlap or be close to the current via near the resistive element.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If a substrate-mounted resistor is used in a current sensing device, then the device size can be reduced, but the current sensing accuracy deteriorates due to lack of appropriate voltage sensing structure

Engineering Contradiction:
Improvedevice sizeVSAvoidcurrent sensing accuracy
Core Design Contradiction:
Volume of moving objectVSMeasurement precision

Solution Approach 1:

The patent transitions from a planar substrate-mounted resistor configuration to a three-dimensional laminate structure with multiple insulating layers and via holes. This dimensional change enables the voltage sensing via to be positioned directly above the resistive element through the interlayer insulating layer, achieving accurate voltage sensing while maintaining compact device size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces an interlayer insulating layer as an intermediary between the current wire and the voltage sensing via. This intermediary layer with controlled dielectric properties enables electrical isolation while allowing the voltage sensing via to penetrate through and make contact with the resistive element, solving the voltage sensing accuracy problem in compact devices.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If the voltage sensing via is positioned close to the resistive element, then the current sensing accuracy is improved, but the device complexity increases due to additional via hole formation and alignment requirements

Engineering Contradiction:
Improvecurrent sensing accuracyVSAvoidstructure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The via holes in the laminate structure serve multiple functions: they provide electrical connection between layers, enable positioning of voltage sensing elements close to the resistive element for accurate sensing, and maintain structural integrity. This multi-functionality reduces overall device complexity despite the proximity requirement.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent uses a composite laminate structure combining multiple insulating layers with different properties, conductive via holes, and resistive elements. This composite approach allows the voltage sensing via to be positioned close to the resistive element while managing electrical isolation, heat dissipation, and mechanical stability, thereby improving accuracy without excessive complexity increase.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves current sensing accuracy and reliability in current sensing devices by stabilizing current flow and reducing the influence of Temperature Coefficient Resistance (TCR).

Implementation Method 1

a voltage sensing via configured to obtain a voltage drop in the current sensing element

Methodology Applied
Scientific EffectVoltage drop measurement: Ohm's Law

Implementation Method 2

a plurality of current vias configured to connect the current sensing element and the current wire so as to penetrate through the interlayer insulating layer

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11346862B2Current sensing device
Publication Date: 2022.05.31 KOA CORP
  • US11346862B2 patent drawing
  • US11346862B2 patent drawing
  • US11346862B2 patent drawing

AI summary

Provided is a current sensing device including: a laminate having a plurality of insulating layers laminated therein; a current sensing element provided in an inner layer of the laminate; a current wire configured to flow current to the current sensing element, the current wire being provided with respect to the current sensing element via an interlayer insulating layer; a plurality of current vias configured to connect the current sensing element and the current wire so as to penetrate through the interlayer insulating layer; and a voltage sensing via configured to obtain a voltage drop in the current sensing element, the voltage sensing via being electrically connected to the current sensing element.