Opposite-Side Electronic Device Connections on Double-Sided Circuit Boards
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Solution Overview
Problem
The complexity and cost of connecting electronic devices on opposite sides of a circuit board are increased due to the need for complex passages and multiple layers, as well as potential detrimental effects on signal integrity from mirroring package contact positioning without modifications to the chip bond pad layout.
Innovation Solution
The approach involves positioning electronic devices on opposite sides of a substrate with contacts connected by straight conductors through the substrate, where each contact of one device is connected to the most adjacent contact of the other device, allowing for simplified connections and reduced circuit board layers, and locating critical contacts towards the center of the ball grid array to minimize signal integrity effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex passages and multiple layers are used to connect contacts on opposite sides of the circuit board, then connection reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
Instead of routing connections through complex multi-layer passages, the invention inverts the approach by using the top and bottom surfaces of the substrate directly for contact connections. The first set of contacts is on the top surface and the second set is on the bottom surface, connected through simple vias rather than complex internal layers.
Solution Approach 2:
The invention segments the contact connections into two distinct groups: first contacts on the top surface and second contacts on the bottom surface. This segmentation allows each group to be independently positioned and connected, simplifying the overall connection architecture.
2Manufacturing precision
If mirroring package contact positioning is used to connect devices, then connection alignment is improved, but signal integrity deteriorates
Solution Approach 1:
The invention applies different positioning strategies to different contact groups. The first contacts and second contacts can be positioned independently based on their specific signal integrity requirements, rather than forcing a uniform mirrored arrangement. This allows optimization of signal paths for each contact group.
3Reliability
If multiple layers are used for circuit board connections, then connection reliability is improved, but manufacturing cost and production complexity increase
Solution Approach 1:
The invention inverts the conventional multi-layer approach by using the external surfaces of the substrate for contact placement. Instead of embedding connections deep within multiple internal layers, the contacts are positioned on the top and bottom surfaces, reducing the number of manufacturing layers required.
Data Source
AI summary
In the present electronic structure, a substrate is provided in the form of a circuit board. First and second electronic devices are positioned on opposite sides of the circuit board, each having a plurality of contacts connected to the circuit board. Each of the contacts of the first device is connected to a contact of the second device by a connector though the circuit board. At least one of the contacts of the first device is connected to the contact of the second device which is most adjacent to that contact of the first device across the circuit board.