Wiring Substrate Dual Insulating Layer Cavity Filling
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Solution Overview
Problem
The existing manufacturing method for wiring substrates faces challenges in filling cavities with insulating layers, leading to potential dishing and adverse effects on wiring layer formation, especially when the cavity volume increases, causing insufficient filling and affecting the integrity of the wiring structure.
Innovation Solution
A wiring substrate design where a cavity is filled with two insulating layers, with one layer covering the core and electronic component, and the other layer filling the remaining space, ensuring even filling and preventing dishing, while maintaining uniform heat history for improved wiring layer formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single insulating layer is used to fill the cavity, then the manufacturing process is simple, but the cavity may not be sufficiently filled and dishing occurs when cavity volume increases
Solution Approach 1:
The insulating layer filling process is divided into two segments: first applying an insulating layer over the electronic component and core, then filling the remaining cavity space with another insulating layer. This segmentation allows each layer to be optimized for its specific function, preventing dishing while ensuring complete cavity filling.
Solution Approach 2:
The first insulating layer is applied in advance to cover the electronic component and core surface before the cavity filling process. This preliminary action creates a protective base layer that prevents dishing and provides a stable foundation for subsequent cavity filling.
2Volume of moving object
If the cavity volume is increased to accommodate larger electronic components, then the component accommodation capability is improved, but the insulating layer may not sufficiently fill the cavity causing dishing
Solution Approach 1:
The insulating layer system is segmented into a first layer for surface coverage and a second layer for cavity filling. This allows the cavity volume to be increased for larger components while maintaining insulating layer flatness, as each segment performs its specific function optimally.
Solution Approach 2:
Different regions of the insulating structure are assigned different qualities: the first insulating layer provides a smooth protective surface over the component, while the second insulating layer provides bulk filling material. This local differentiation allows large cavity volumes without dishing.
3Reliability
If vacuum lamination or vacuum hot pressing is used to fill the cavity, then the insulating layer coverage is improved, but dishing occurs when the cavity volume is large
Solution Approach 1:
The vacuum lamination process is applied in two segments: first to the insulating layer covering the component and core, then separately to the cavity filling material. This segmentation ensures proper coverage while preventing dishing, as each vacuum pressing step is optimized for its specific thickness and area.
Data Source
AI summary
A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, a second wiring layer formed on a second surface of the core, and an electronic component partially accommodated in the cavity and including a projected portion projected from the first opening of the core. A first insulating layer covers a side surface of the electronic component and the first surface of the core and fills a portion of the cavity. A second insulating layer covers the first insulating layer. A third insulating layer covers the second surface of the core. The remainder of the cavity that is not filled with the first insulating layer is filled with the third insulating layer.