DC-DC Converter Thermal Management Using PCB Heat Conduction

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Solution Overview

Problem

Existing thermal management methods for DC-DC power converters, such as using top-mounted heatsinks, are costly, add weight, and restrict design flexibility due to the need for specific component placement and complex assembly processes, while also requiring significant space and forced airflow for effective heat dissipation.

Innovation Solution

A thermal interface material is placed between the power converter and the motherboard to conduct heat from the bottom side, eliminating the need for heavy baseplates and heatsinks, allowing for flexible component placement and efficient heat dissipation without relying on forced airflow.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If top-mounted heatsinks and baseplates are used for heat dissipation, then heat dissipation effectiveness is improved, but device weight increases and design flexibility is reduced

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidconverter weight

Core Design Contradiction:

TemperatureVSWeight of moving object

Solution Approach 1:

The invention extracts the heat dissipation function from the traditional top-mounted heatsink/baseplate configuration and relocates it to the bottom of the converter by utilizing the PCB as a heat sink. This eliminates the need for heavy metal baseplates while maintaining effective heat dissipation through the PCB's large surface area and thermal conductivity.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of dissipating heat from the top surface as in conventional designs, the invention inverts the heat dissipation path by conducting heat from the bottom of the converter through the PCB to the PCB's surface area, which then dissipates heat to the ambient environment.

Inventive Principle:

Principle #13The other way round (Inversion)

2Temperature

If top-mounted heatsinks are used, then heat dissipation is improved, but manufacturing cost and device complexity increase

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidthermal management structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The PCB serves multiple functions simultaneously: it provides electrical connections, mechanical support, and heat dissipation. By making the PCB thermally conductive and utilizing its large surface area, the design eliminates the need for separate heatsinks and baseplates, reducing overall device complexity and manufacturing cost.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The invention merges the heat dissipation function with the existing PCB structure. Instead of adding separate thermal management components, the PCB itself is designed to conduct and dissipate heat, combining structural and thermal management functions into a single component.

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If top surface heat transfer methods are used, then heat dissipation is achieved, but design flexibility and component placement freedom are reduced

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidlayout design flexibility

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The invention inverts the conventional heat dissipation approach by moving from top-surface dissipation to bottom-surface dissipation through the PCB. This allows power-dissipating components to be placed on the bottom of the converter without thermal constraints, as the PCB naturally conducts heat away from these components to its surface area.

Inventive Principle:

Principle #13The other way round (Inversion)

4Temperature

If heavy baseplates and heatsinks are used, then heat dissipation effectiveness is improved, but assembly complexity and stress on solder joints increase

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidassembly simplicity

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The invention removes the heavy baseplate and heatsink components entirely, extracting only the essential heat dissipation function and achieving it through the PCB's inherent thermal properties. This eliminates complex assembly steps and reduces mechanical stress on solder joints that would result from attaching heavy thermal management components.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method significantly reduces costs, increases reliability, and enhances design flexibility by achieving a 45% improvement in usable power without the need for additional structural support or complex assembly, while maintaining effective cooling even without forced convection.

Implementation Method 1

The thermal interface material fills the gap between the power converter components and the motherboard, thereby providing a heat conductive path for dissipating heat from the power converter to the motherboard

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8531841B2IC thermal management system

Publication Date: 2013.09.10 TDK LAMBDA CORP

AI summary

The present invention provides a non-intrusive method for dissipating heat from open-frame DC-DC power converters where bottom side components are exposed. A thermal interface material is placed between the motherboard to which the power converter is soldered and power dissipating and temperature sensitive components on the bottom of the power converter. The thermal interface material fills the gap between the power converter components and the motherboard, thereby providing a heat conductive path for dissipating heat from the power converter to the motherboard.