Optical Component Embedded PCB Thermal Management
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Solution Overview
Problem
Conventional LEF packaging technologies for optical components like LEDs and image sensors face inefficiencies in heat release, primarily relying on lead frames for thermal dissipation, which can limit the performance of high-luminance LEDs and high-resolution image sensors.
Innovation Solution
An optical component embedded printed circuit board design featuring a metal core with cavities, a transparent insulation layer, and a circuit pattern, along with thermal vias for enhanced heat dissipation, and optionally an infrared filter for image sensors, to improve heat release efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional LED packaging technology using lead frame is used, then electrical connection is achieved, but heat release efficiency is insufficient
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional lead frame structure and creates a dedicated heat release path through the printed circuit board using metal core with cavities and thermal vias. This separates the electrical connection function (performed by circuit patterns) from the thermal management function (performed by metal core and vias), allowing optimized heat release without compromising electrical connectivity.
Solution Approach 2:
The patent employs a composite structure combining metal core (for thermal conduction), insulation layers (for electrical isolation), and circuit patterns (for electrical connection). The metal core with cavities filled with thermal conductive material creates a composite thermal management system that integrates multiple materials with complementary properties to achieve superior heat dissipation.
2Power
If lead frame structure is used for electrical contact, then electrical connection is established, but thermal dissipation capability is limited
Solution Approach 1:
The printed circuit board in the patent serves multiple functions simultaneously: it provides electrical connection through circuit patterns, thermal management through metal core and thermal vias, mechanical support through the layered structure, and optical management through the transparent insulation layer. This multi-functional integration eliminates the need for separate lead frame components while enhancing thermal dissipation.
Solution Approach 2:
The patent merges the functions of lead frame (electrical connection), heat sink (thermal dissipation), and substrate (mechanical support) into a single integrated printed circuit board structure. The metal core with cavities and thermal vias combines thermal management with structural support, while circuit patterns provide electrical connectivity, eliminating the need for separate components.
3Temperature
If heat is released through lead frame, then thermal management is provided, but heat release efficiency is insufficient for high-luminance LEDs
Solution Approach 1:
The patent applies local quality enhancement by creating cavities in the metal core at specific locations where heat generation is highest (around the LED), and filling these cavities with thermal conductive material. The thermal vias are strategically positioned to create efficient heat transfer paths from the LED mounting area to the heat dissipation surfaces, concentrating thermal management resources where most needed.
Solution Approach 2:
The patent transitions from two-dimensional heat dissipation (through the lead frame plane) to three-dimensional heat management by creating vertical heat transfer paths through thermal vias that extend through multiple layers of the printed circuit board. This adds a vertical dimension to heat flow, enabling more efficient thermal conduction from the LED mounting area to external heat dissipation surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases heat release efficiency, allowing for improved performance of optical components by efficiently dissipating heat through the printed circuit board, thereby enhancing the functionality of LEDs and image sensors.
Implementation Method 1
A via may be formed in the first insulation layer that provides thermal connection between the metal core and the circuit pattern. The heat inside may be released to the outside through the via.
Implementation Method 2
The optical component may be an LED, in which case at least a portion of the second insulation layer over the LED may have a curved surface about the LED or may have roughness. This may be to diffuse the light emitted from the LED.
Data Source
AI summary
A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component.