Via Hole Conductor Protrusion for Multilayer Electronic Component Shrinkage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic components with stacked insulating layers and helical coil conductors experience disconnections between via hole conductors and coil conductor patterns due to shrinkage during the manufacturing process, particularly when formed using photolithography methods.
Innovation Solution
The electronic component design includes a via hole conductor with a connection surface formed of a circular portion and a protrusion that protrudes in the direction of the line conductor layer, which helps maintain connectivity by reducing shrinkage and preventing disconnections, and the manufacturing method involves forming these features using a photolithography process with specific masks to ensure proper shaping and connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional via hole conductor with a flat circular connection surface is used, then the manufacturing process is simple, but disconnections occur between the via hole conductor and line conductor layer due to shrinkage during drying and sintering
Solution Approach 1:
The protrusion is formed in advance on the via hole conductor before the line conductor layer is deposited. This preliminary structural preparation ensures that even when shrinkage occurs during subsequent drying and sintering processes, the pre-formed protrusion maintains adequate contact area with the line conductor layer, preventing disconnections.
Solution Approach 2:
The protrusion structure acts as a cushioning feature that compensates for the expected shrinkage during the manufacturing process. By having this extra material protruding toward the line conductor layer beforehand, the design anticipates and mitigates the harmful effect of shrinkage-induced disconnections.
2Reliability
If the via hole conductor connection surface is enlarged to prevent disconnections, then connectivity reliability improves, but the amount of conductor material and manufacturing complexity increase
Solution Approach 1:
Instead of uniformly enlarging the entire via hole conductor connection surface, the invention applies a localized protrusion only in the specific region where contact with the line conductor layer occurs. This localized approach increases connectivity reliability at the critical interface without significantly increasing the overall conductor material quantity.
Data Source
AI summary
Provided is an electronic component that can suppress the occurrence of disconnections between line conductor layers and via hole conductors and a method of manufacturing the electronic component. A multilayer body is formed by stacking insulating layers. A conductor layer is provided on a first insulating layer. A line conductor layer is provided on a second insulating layer that is provided on an upper side of the first insulating layer in a stacking (z-axis) direction. A via hole conductor connects an end portion of the line conductor layer to the conductor layer and extends through the second insulating layer in the z-axis direction. In the via hole conductor, a connection surface connected to the line conductor layer is formed of a circular portion and a protrusion. The protrusion protrudes from the circular portion in the x-axis direction in which the line conductor layer extends from the end portion.