Embedded Component Multi-Layer Wiring Board Thickness Adaptation

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Solution Overview

Problem

Conventional multi-layer wiring boards with embedded electronic components face complexity in manufacturing due to varying component thicknesses, requiring intricate stacking processes and potential material property mismatches.

Innovation Solution

The method involves thermal compression bonding of printed wiring boards with an embedding-dedicated board set to 80-125% of the second electronic component's thickness, formed from the same material, allowing for standardized mounting and simplified manufacturing by aligning the first electronic component's thickness with the second, and forming wiring circuits on both surfaces of the embedding-dedicated board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional methods are used to build in electronic components of different thicknesses, then electronic components can be integrated into multi-layer wiring boards, but a complicated stacking process is required to adjust different thicknesses

Engineering Contradiction:

Improveability to integrate electronic components of different thicknessesVSAvoidcomplicated stacking process

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

An embedding-dedicated board is introduced as an intermediary component between the electronic component and the printed wiring board. This dedicated board has a thickness of 80% to 125% of the electronic component's thickness and provides a standardized mounting surface, eliminating the need for complex thickness adjustment processes while enabling integration of components with varying thicknesses

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The mounting structure is segmented into distinct functional layers: the embedding-dedicated board serves as a separate intermediary layer between the electronic component and the printed wiring board. This segmentation allows each layer to be optimized independently, with the embedding-dedicated board handling thickness variation while the printed wiring board maintains its standard structure

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If embedding-dedicated board and printed wiring board are made from different materials, then design flexibility is increased, but strain occurs due to difference in physical property values during thermal compression bonding

Engineering Contradiction:

Improvedesign flexibilityVSAvoidstrain during thermal compression bonding

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The embedding-dedicated board and the printed wiring board are both made from the same material (e.g., both from CCL or both from metal substrate). This material homogeneity ensures that their physical property values, particularly thermal expansion coefficients, are matched, preventing strain and deformation during thermal compression bonding while still allowing design flexibility through the dedicated board's thickness adjustment

Inventive Principle:

Principle #33Homogeneity

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables stable, long-term quality and simplifies the manufacturing process by standardizing mounting procedures and avoiding material property-related issues, allowing for efficient integration of electronic components of different thicknesses into a multi-layer wiring board.

Implementation Method 1

collectively stacking a plurality of printed wiring boards therein by thermal compression bonding

Methodology Applied

Scientific EffectThermal compression bonding:

Data Source

PatentUS9351410B2Electronic component built-in multi-layer wiring board and method of manufacturing the same

Publication Date: 2016.05.24 FUJIKURA LTD

AI summary

An electronic component built-in multi-layer wiring board that is configured by collectively stacking a plurality of printed wiring boards therein by thermal compression bonding and that has a plurality of electronic components built in thereto, wherein the electronic components include a first electronic component and a second electronic component having a thickness which is greater than that of the first electronic component, the first electronic component is built in to an embedding-dedicated board set to a thickness which is 80% to 125% of the thickness of the second electronic component, and the embedding-dedicated board and the second electronic component are then mounted on the printed wiring board and thereby built in to the electronic component built-in multi-layer wiring board, and the embedding-dedicated board is formed by an identical material to that of the printed wiring board.