Optoelectronic Device Anisotropic Conductive Adhesive Interconnect

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Solution Overview

Problem

Current optoelectronic devices face challenges in achieving efficient and cost-effective integration with substrates, particularly in creating stable electroconductive connections that prevent short circuits and allow for compact, space-saving designs while maintaining mechanical stability.

Innovation Solution

The use of an optoelectronic device with electroconductively connected substrates, where a stiff second substrate made of glass or laminate is interconnected with a first substrate via electroconductive paths and an anisotropic conductive adhesive, ensuring precise electrical connections and mechanical stability without short circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional optoelectronic devices are integrated with substrates, then device functionality is achieved, but mechanical stability and electroconductive connection reliability deteriorate

Engineering Contradiction:

Improveelectroconductive connection reliabilityVSAvoidmechanical stability

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

An anisotropic conductive adhesive is introduced as an intermediary layer between the optoelectronic device and substrate. This adhesive provides both mechanical bonding stability and controlled electroconductive paths, resolving the contradiction by mediating between mechanical and electrical requirements without causing short circuits.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs a composite structure combining rigid substrate, flexible circuit board, and anisotropic conductive adhesive. This composite approach allows each material to fulfill its specific function - structural support, electrical connection, and mechanical bonding - simultaneously achieving both mechanical stability and electroconductive reliability.

Inventive Principle:

Principle #40Composite materials

2Volume of moving object

If compact design is implemented to save space, then device size is reduced, but manufacturing complexity and assembly difficulty increase

Engineering Contradiction:

Improvedevice sizeVSAvoidassembly ease

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent merges the substrate and circuit board into a integrated assembly where the anisotropic conductive adhesive simultaneously provides mechanical bonding and electrical connection functions. This merging reduces the number of separate assembly steps and components, making compact design manufacturable without proportionally increasing complexity.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If stable electroconductive connections are created, then electrical reliability is improved, but risk of short circuits increases

Engineering Contradiction:

Improveelectrical reliabilityVSAvoidshort circuit risk

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The anisotropic conductive adhesive provides different properties in different directions: it conducts electricity in the horizontal plane (parallel to substrate) while maintaining electrical isolation in the vertical direction (perpendicular to substrate). This local quality differentiation allows stable electroconductive connections without creating short circuit paths between different electrical potentials.

Inventive Principle:

Principle #3Local quality

4Adaptability or versatility

If integration with substrate is achieved, then device functionality is enabled, but manufacturing cost increases

Engineering Contradiction:

Improvedevice functionalityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The anisotropic conductive adhesive performs multiple functions simultaneously - mechanical bonding, electrical connection, and electrical isolation - without requiring additional separate components or process steps. This self-service capability enables device functionality while controlling manufacturing cost by eliminating the need for multiple specialized materials and assembly operations.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables high-efficiency, cost-effective optoelectronic devices with stable electroconductive connections, preventing short circuits and allowing for compact designs suitable for various applications, including display and lighting devices.

Implementation Method 1

interconnected with a first substrate via electroconductive paths and an anisotropic conductive adhesive

Methodology Applied

Scientific EffectAnisotropic conduction: Anisotropy

Data Source

PatentUS8330053B2Optoelectronic device and method for producing an optoelectronic device

Publication Date: 2012.12.11 DOLYA HOLDCO 5 LTD

AI summary

An optoelectronic device includes an optoelectronic component, the optoelectronic component having an active region and at least one first conductive path on a first substrate, wherein the first conductive path is electrically connected to the active region. Further, the optoelectronic device comprises a second substrate with at least one second conductive path, wherein the first conductive path and the second conductive path are electrically connected to one another.