Inductor Plating Layer Peeling Prevention via Resin Roughness
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Solution Overview
Problem
Existing inductor components with plating-based wiring electrodes on resin layers face issues with peeling due to external stress and heat, despite techniques to enhance contact area, as the close contact force of the plating film with the resin layer remains inadequate.
Innovation Solution
The inductor component design features a resin layer with a surface roughness greater than the columnar conductor's end surface, utilizing a plating layer that contacts both the conductor's end and main surfaces, and includes a two-layer metal film structure for improved connection and reduced resistance, with the main surface of the resin layer being coarser than the conductor's end surface to enhance contact strength and prevent peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the surface of the resin layer is made rough to increase contact area, then peeling resistance is improved, but manufacturing precision becomes more difficult to control
Solution Approach 1:
The patent specifies a quantitative relationship between surface roughness parameters: the arithmetic mean roughness of the resin layer surface (Ra1) is made larger than that of the columnar conductor end surface (Ra2). This parameter-based approach provides clear manufacturing targets and inspection criteria, making it easier to control surface roughness within acceptable ranges while achieving the desired peeling resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces peeling of the plating layer from the resin layer, lowers the inductor electrode's resistance, and prevents heat generation and disconnection issues by maintaining strong connections between the plating layer and columnar conductors, while also improving heat dissipation characteristics.
Implementation Method 1
forming, by non-electrolytic plating, metal films of copper or the like on wall surfaces of grooves 102a formed in the surface of the resin layer 102, and then, embedding inner portions of the grooves 102a by electrolytic plating
Implementation Method 2
forming the wiring electrode having a portion making contact with the end surface of the first columnar conductor and a portion making contact with the main surface of the resin layer on the main surface of the resin layer by plating
Implementation Method 3
surface roughness of the main surface of the resin layer is larger than surface roughness of the end surface of the first columnar conductor... close contact strength of the plating layer with the main surface of the resin layer is increased by making the main surface of the resin layer coarse
Data Source
AI summary
A coil electrode included in an inductor component includes a plurality of metal pins upper end surfaces of which are exposed to the upper surface of a resin layer and lower end surfaces of which are exposed to a lower surface of the resin layer, and a plurality of wiring patterns that connect the upper end surfaces or the lower end surfaces of the predetermined metal pins, wherein surface roughnesses of the upper surface and the lower surface of the resin layer are larger than surface roughnesses of the upper end surfaces and the lower end surfaces of the respective metal pins, and wiring patterns are respectively formed on the upper and lower surfaces of the resin layer by plating.