Electronic Component Housing Package with Dielectric Projection for Phase Alignment
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Solution Overview
Problem
In electronic component housing packages with radial signal line arrangements, the difference in length between centrally-located and outwardly-located signal lines leads to phase differences in signal propagation, which worsens with increasing numbers of signal lines and higher frequency processing.
Innovation Solution
The package incorporates a dielectric substrate with a frame body and a projection that covers part of the shorter signal line conductor, increasing its signal transmission time and reducing the phase difference with longer conductors by altering the signal propagation speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple signal lines are arranged in a radial layout to accommodate electronic components, then the electronic component can be integrated into the package, but the length difference between centrally-located and outwardly-located signal lines causes phase difference between signals
Solution Approach 1:
The patent applies local quality by extending the shorter signal lines (centrally-located) with additional dielectric material only in specific regions where length compensation is needed. This creates different effective lengths for different signal lines based on their position, allowing each signal line to have its transmission distance adjusted individually to compensate for radial layout differences while maintaining overall package functionality.
2Productivity
If the number of signal lines is increased to achieve high frequency signal processing and high integration, then the electronic component functionality is enhanced, but the phase difference between signals propagating through different signal lines increases
Solution Approach 1:
The patent changes the physical parameter of signal line length by extending the shorter signal lines with additional dielectric material. This parameter adjustment compensates for the inherent length differences in radial layouts, ensuring that even as the number of signal lines increases for high-frequency processing, the phase differences between signals remain controlled within acceptable tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the signal phase difference between conductors of varying lengths, allowing for more efficient high-frequency signal processing without the need for extensive routing adjustments, thereby enhancing the package's performance and reliability.
Implementation Method 1
In the part of the first wiring conductor covered with the dielectric-made projection, as compared to a non-covered part, a signal propagates at a lower speed
Data Source
AI summary
While it is necessary for an electronic component housing package to be provided with numerous wiring conductors, phase differences of signals caused by differences in signal transmission distance among the wiring conductors, is a problem. An electronic component housing package based on one embodiment includes a substrate having a dielectric region and an electronic component placement region, a frame body surrounding the dielectric region and the placement region, and wiring conductors disposed on the dielectric region of the substrate. The wiring conductors have a first wiring conductor and a second wiring conductor which is longer in signal transmission distance than the first wiring conductor, which are disposed so as to extend from a location immediately below the frame body to the dielectric region. The frame body made of a dielectric material has a projection protruding from its inner periphery, which covers at least part of the first wiring conductor.