PCB Concave-Convex Surface for Semiconductor Chip Shear Strength
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Solution Overview
Problem
Conventional methods for fixing semiconductor chips to printed circuit boards result in complex PCB structures with low shear strength, necessitating a simpler structure that enhances the stability and shear strength of the chip attachment.
Innovation Solution
A semiconductor package design featuring a printed circuit board with a base substrate having a concave-convex portion on one surface and an adhesive layer on the opposite surface, with exposed wiring layers and pads through-holes, allowing for increased contact area and adhesive force between the chip and the substrate, and electrical connection members for stable chip attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional methods are used to fix semiconductor chips to PCBs with metal wiring layers and overcoat layers, then the chip can be attached, but the PCB structure becomes complex and the shear strength of the chip attachment is low
Solution Approach 1:
The invention extracts and eliminates the overcoat layer from the conventional PCB structure. By removing this unnecessary layer, the PCB structure is simplified while the chip attachment surface is directly formed on the base substrate with concave-convex portions, thereby improving shear strength without the complexity of multiple layers
Solution Approach 2:
The invention applies local quality by creating concave-convex portions at specific locations on the chip attachment surface. These localized structural features increase the adhesive area and mechanical interlocking between the chip and PCB, enhancing shear strength only where needed rather than requiring complex overall structure
2Stability of the object's composition
If conventional chip fixing methods are used, then the chip can be mounted, but the attachment stability is insufficient
Solution Approach 1:
The concave-convex portions are strategically formed on the chip attachment surface to provide localized mechanical interlocking features. This local structural modification significantly improves attachment stability by increasing the bonding area and preventing chip displacement, without requiring complex overall PCB design
Solution Approach 2:
The concave-convex portions introduce curved surface features that enhance the mechanical interlocking between the adhesive layer and the PCB substrate. The curved geometry of these portions provides better stress distribution and stronger bonding compared to flat surfaces, improving chip mounting stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design stabilizes semiconductor chip attachment, simplifies PCB structures, and enhances resistance to shear forces, eliminating the need for an overcoat layer and enabling efficient wire bonding processes, while expanding packaging technology capabilities.
Implementation Method 1
an adhesive member that is disposed on the first surface of the base substrate and adheres the semiconductor chip to the first surface
Data Source
AI summary
A printed circuit board and a semiconductor package using the same. The semiconductor package includes a printed circuit board (PCB) and a semiconductor chip mounted on the PCB. The printed circuit board includes a base substrate that has a first surface and a second surface which are positioned opposite to each other, and has through-holes, the first surface having a concave-convex portion, an adhesive layer that is disposed on the second surface of the base substrate, a wiring layer that is attached to the second surface of the base substrate by the adhesive layer and that comprises exposed portions exposed through the through-holes, an adhesive member that is disposed on the first surface of the base substrate and adheres the semiconductor chip to the first surface, and electrical connection members that electrically connect the wiring layer with the semiconductor chip.