Aircraft Electronic Device Thermal Management via Insulated Casing

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Solution Overview

Problem

The existing electronic devices in aircraft actuators face overheating issues due to direct heat conduction from heating elements, which can lead to circuit failure.

Innovation Solution

The electronic device is designed with a casing that directs heat from the heating element through its side and bottom walls, allowing for radiation and reducing the amount of heat that reaches the circuit portion, using a heat-insulating material and strategically positioned bosses and spacers to minimize thermal conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the circuit portion is fixed directly to the heating element using bosses, then the structure is simple and easy to manufacture, but the circuit portion overheats due to direct heat conduction

Engineering Contradiction:
Improveease of manufactureVSAvoidreliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

A casing made of heat-insulating material is introduced as an intermediary between the heating element and the circuit portion. The casing receives heat from the heating element through its first surface and conducts it to the circuit portion through its second surface, while the heat-insulating material reduces heat conduction loss, thereby preventing overheating of the circuit portion while maintaining a simple structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If a heat-insulating material is used in the casing, then heat conduction to the circuit portion is reduced, but the thermal management becomes more complex

Engineering Contradiction:
ImprovereliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The casing serves multiple functions simultaneously: it provides structural support for mounting the circuit portion, acts as a heat-insulating barrier to prevent overheating, and facilitates controlled heat transfer from the heating element to the circuit portion. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If the casing is made with thick walls to reduce heat conduction, then heat insulation improves, but the weight of the electronic device increases

Engineering Contradiction:
ImprovereliabilityVSAvoidweight
Core Design Contradiction:
ReliabilityVSWeight of moving object

Solution Approach 1:

The casing is constructed using composite materials or materials with graded thermal conductivity, combining heat-insulating materials with structurally sound materials. This allows the casing to provide adequate heat insulation with reduced wall thickness, thereby preventing overheating while minimizing the increase in device weight.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively reduces the heat reaching the circuit portion, preventing overheating and potential failure while maintaining weight reduction through the use of aluminum alloy and stainless steel materials.

Implementation Method 1

the heat from the heating element is conducted to the casing and passes through the side wall and the bottom wall of the casing to reach the boss and further the circuit portion

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

When the heat passes such a path, the heat is radiated from the casing while it is conducted through the casing

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

using a heat-insulating material and strategically positioned bosses and spacers to minimize thermal conductivity

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentEP3829281B1Electronic device for aircraft
Publication Date: 2024.09.11 NABTESCO CORP
  • EP3829281B1 patent drawingFigure 1
  • EP3829281B1 patent drawingFigure 2

AI summary

An electronic device (20) includes: a casing (60) including a bottom wall (62) and a side wall (64) rising from the bottom wall (62), the side wall (64) being attached to a manifold (16) of an actuator (10) in an aircraft at an opposite side to the bottom wall (62); a boss (70) projecting from the bottom wall (62) toward the opposite side to the bottom wall (62) with respect to the side wall (64); and a circuit portion (50) fixed to the boss (70).