Modifications By Conduction Heat Transfer TRIZ Cases
- Hinged Liquid-Cooled Heat Sink for Drawer Immersion Cooling
A hinged liquid-cooled heat sink rotates within a dielectric fluid compartment to dissipate thermal energy from electronic components.
- Anisotropic Thermal Conductive Film Heat Sink for Lightweight Electronics
A heat sink composed of anisotropic thermal conductive films dissipates heat efficiently through high in-plane conductivity.
- Double-Sided Cold Plate With Overhanging Heat Sinks for High Power Density
A double-sided cold plate uses overhanging heat sinks to mechanically support electrical components while providing liquid cooling.
- Liquid Cooling Transceiver Thermal Management
Cooling fluid channels dissipate heat from high-speed transceiver modules, resolving insufficient air cooling for 800 G transmissions.
- Stamped Metal Heat Dissipation Component for Optical Transceivers
A stamped metal heat dissipation component transfers thermal energy from optoelectronic devices to the housing.
- Vehicle Radar Sensor Heat Conductor Design
Curable paste heat conductors transfer thermal energy from the measurement unit to the housing.
- Modular Thermal Energy Management for Data Centers
A modular thermal energy management system uses nested containers with separate liquid coolants to surround heat sources and reduce overall coolant volume.