Hinged Liquid-Cooled Heat Sink for Drawer Immersion Cooling
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Solution Overview
Problem
Traditional air cooling methods are inadequate for effectively managing heat in high-power density electronic components, leading to thermal runaway conditions, especially in densely packed circuits and high-heat flux applications, necessitating more aggressive thermal management techniques.
Innovation Solution
A liquid-cooled cooling apparatus with a dielectric fluid and a hinged, liquid-cooled heat sink is used, where the enclosure accommodates electronic components and allows for rotational positioning between operational and service modes, facilitating efficient heat dissipation without the need for forced air cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional air cooling methods are used, then device simplicity is maintained, but heat removal capability is insufficient for high power density components
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by immersing electronic components in a dielectric fluid. The liquid cooling system with heat sinks provides superior heat transfer capability compared to air cooling, enabling effective thermal management of high power density components while managing the added complexity through proper system design
Solution Approach 2:
The patent changes the cooling medium from gas (air) to liquid (dielectric fluid), fundamentally altering the heat transfer parameters. This parameter change enables much higher heat flux removal capability, addressing the insufficient heat removal of traditional air cooling methods
2Power
If liquid cooling is implemented, then heat removal effectiveness is improved, but serviceability of electronic components deteriorates
Solution Approach 1:
The patent employs a hinged heat sink design that can rotate between an operational position (overlying the components for cooling) and a service position (allowing access to components). This dynamic positioning mechanism resolves the contradiction by enabling both effective liquid cooling during operation and easy component access during maintenance
Solution Approach 2:
The cooling system is segmented into a movable heat sink portion and a stationary enclosure containing the dielectric fluid. This segmentation allows the heat sink to be independently positioned, enabling serviceability while maintaining cooling effectiveness during normal operation
3Productivity
If electronic components are densely packed, then productivity is improved, but heat flux increases leading to thermal runaway risk
Solution Approach 1:
The patent uses liquid dielectric cooling instead of air cooling to manage the high heat flux generated by densely packed components. The liquid cooling system provides superior heat transfer coefficients, enabling effective removal of concentrated heat from high-density component arrangements and preventing thermal runaway
Solution Approach 2:
The dielectric fluid acts as an intermediary medium between the densely packed electronic components and the heat sink. This intermediary enables efficient heat transfer from the high-power-density components while the fluid's dielectric properties allow it to safely contact the electronic components during immersion cooling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables enhanced heat removal, increased energy efficiency, and improved computing performance by immersing components in a dielectric fluid, allowing for higher component packing densities and reducing the risk of thermal runaway, while maintaining field serviceability.
Implementation Method 1
a liquid dielectric that at least partially immerses the one or more electronic components to be cooled
Implementation Method 2
a hinged, liquid-cooled heat sink disposed within the compartment of the enclosure, and operatively facilitating cooling the one or more electronic components via the dielectric fluid within the compartment
Data Source
AI summary
Cooling apparatuses and methods of fabrication are provided which facilitate immersion-cooling of an electronic component(s). The cooling apparatus includes a drawer-level enclosure sized to reside within an electronics rack. The drawer-level enclosure includes a compartment which accommodates one or more electronic components to be cooled. A dielectric fluid is disposed within the compartment. The dielectric fluid includes a liquid dielectric which at least partially immerses the electronic component(s) within the compartment(s). A hinged, liquid-cooled heat sink is also disposed within the compartment of the enclosure. The heat sink operatively facilitates cooling the one or more electronic components via the dielectric fluid within the compartment, and is rotatable between an operational position overlying the electronic component(s), and a service position which allows access to the electronic component(s).