Double-Sided Cold Plate With Overhanging Heat Sinks for High Power Density
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Solution Overview
Problem
Conventional heat sinks are inadequate for managing the increased heat flux in high-power density power electronics, especially in compact and variable arrangements, necessitating more efficient cooling solutions that also provide mechanical support and efficient electrical connections.
Innovation Solution
A double-sided cold plate design featuring a manifold with overhanging heat sinks and through-body bus bars, allowing for liquid cooling of power electronic components, mechanical support for capacitors, and reduced electrical resistance through direct connections between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional heat sinks are used, then the structure is simple, but the heat flux rejection capability is insufficient for high-power density power electronics
Solution Approach 1:
The cooling assembly is divided into multiple heat sinks positioned on both the top and bottom surfaces of the manifold, allowing distributed heat rejection across multiple locations. This segmentation enables each heat sink to handle a portion of the total heat flux, collectively achieving high-power density cooling without requiring a single overly complex heat rejection structure
Solution Approach 2:
The invention transitions from conventional single-sided heat sink arrangements to double-sided cooling with heat sinks on both top and bottom surfaces of the manifold. This dimensional expansion effectively doubles the heat rejection surface area, enabling the system to handle high heat flux from power electronics while maintaining a compact footprint
2Power
If power electronics devices operate at increased power levels, then the power density increases, but the heat flux generated increases correspondingly making conventional cooling inadequate
Solution Approach 1:
Multiple heat sinks are merged into a unified double-sided cooling system that operates in parallel. The heat sinks on both surfaces of the manifold work simultaneously to reject heat, creating a combined cooling capacity that is greater than the sum of individual single-sided systems, thereby maintaining operating temperature control at high power densities
Solution Approach 2:
The manifold serves multiple functions: it distributes cooling fluid to heat sinks on both top and bottom surfaces, provides structural support for power electronics devices, and acts as a thermal conduit between heat sources and heat rejection surfaces. This multi-functionality enables effective temperature control without adding separate cooling components that would increase complexity
3Volume of moving object
If compact and variable arrangements of power electronics modules are used, then the system size decreases, but the configurability and adaptability of cooling assemblies becomes more difficult
Solution Approach 1:
The cooling assembly employs asymmetric heat sink configurations where heat sinks on the top surface may differ in size, shape, or number from those on the bottom surface. This asymmetry allows customization of cooling capacity for each surface based on the specific thermal requirements of power electronics modules, enabling adaptability to various compact arrangements while maintaining a small footprint
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively manages high heat flux, increases power density by 15% or more, and maintains a compact footprint while supporting diverse component sizes and heat loads, enhancing thermal and electrical efficiency.
Implementation Method 1
The cooling fluid may be introduced to the heat management device, where it receives heat from the heat management device, primarily through convective and/or conductive heat transfer
Implementation Method 2
The cooling fluid may be introduced to the heat management device, where it receives heat from the heat management device, primarily through convective and/or conductive heat transfer
Implementation Method 3
fluid may be directed in a jet in a localized region at a high velocity such that the fluid impinges a surface of the heat management device coupled to the heat generating device
Data Source
AI summary
A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.