Aircraft Electronic Heat Dissipation via Nested Thermal Buffering
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Solution Overview
Problem
Electronic systems in aircraft face reliability and lifespan issues due to exposure to extreme thermal variations, as existing heat dissipation systems are limited by the use of a cold source in direct contact, which exacerbates temperature fluctuations and environmental constraints.
Innovation Solution
A heat dissipation system with a housing featuring an external cover in contact with a first cold source and an internal cover containing a second cold source with higher thermal capacity, isolating the electronic system from temperature variations while allowing effective heat dissipation, using materials like water to absorb temperature changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a cold source is used in direct contact with the electronic system for heat dissipation, then heat dissipation efficiency is improved, but the electronic system is exposed to temperature fluctuations and environmental constraints
Solution Approach 1:
The patent introduces a housing as an intermediary structure between the electronic system and the cold source. The housing includes an external cover for heat dissipation contact and an internal cover containing a second cold source, creating a thermal buffer zone that isolates the electronic system from direct environmental temperature fluctuations while maintaining effective heat dissipation pathways.
2Weight of stationary object
If the electronic equipment is positioned outside protected areas of the aircraft for weight reduction, then aircraft weight is reduced, but the equipment is exposed to extreme thermal conditions
Solution Approach 1:
The housing is segmented into distinct functional zones: an external cover for heat dissipation, an internal cover containing a second cold source, and a protected internal cavity. This segmentation allows the electronic system to be isolated from extreme thermal conditions while maintaining heat dissipation capability, enabling placement in weight-critical external aircraft positions.
3Device complexity
If a single cold source is used for heat dissipation, then device complexity is reduced, but the electronic system cannot be isolated from temperature variations
Solution Approach 1:
The patent implements a nested structure where the internal cover containing the second cold source is positioned within the external cover. This nesting arrangement allows the electronic system to benefit from multiple thermal zones - the external cover provides heat dissipation interface with the environment, while the internal cover with its second cold source provides temperature stabilization, achieving both complexity management and temperature isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the electronic system's exposure to temperature fluctuations, enhancing reliability and lifespan by minimizing the impact of ambient temperature changes and protecting equipment from extreme thermal conditions.
Implementation Method 1
the second cold source has a thermal capacity value greater than the thermal capacity value of the first cold source. Thus, the second cold source absorbs the temperature variations of the first cold source
Implementation Method 2
a housing which comprises an external cover covering the electronic system and adapted to be in contact with a first cold source
Data Source
Figure 1
Figure 2a~2c
AI summary
The invention relates to a system for dissipating the heat generated by an electronic system (1), in particular an electronic device (1) in an aircraft, which comprises a housing having an external lid (3) covering the electronic system (1) and adapted to be in contact with a first cold source (5), and a second cold source (6a) located inside the external lid (3). The housing (4) includes an internal lid located inside the external lid (3) and covering the electronic system (1), the second cold source (6a) being located between the internal and external (3) lids. The invention can particularly be used for protecting an electronic device in an aircraft.