Cooling/Ventilation/Heating Modifications TRIZ Cases

A rotatable monitor exposes heat dissipation fins on an image capturing device casing to enable thermal management.

A cooling plate accommodates an electronic component in a recessed section surrounded by a thermal pipeline.

Ceiling-mounted supply and exhaust air ducts cool server racks without occupying floor space.

Interchangeable radar modules lower cost and enable rapid reconfiguration without rebuilding the entire system.

Segmented cooling areas with independent sensors adjust airflow direction to prevent sheet wrinkles from temperature deviations.

Phase change material maintains constant coolant temperature while liquid-vapor dielectric fluid transfers heat to a condenser for efficient rejection.

A dual-cooling heat sink combines chilled liquid and forced airflow to remove thermal energy from rack-mounted computing devices.

Preliminary action vents air into a hollow dummy device before removal, reducing buoyancy and preventing rapid flotation while maintaining cooling efficiency.

Nested housing isolates aircraft electronics from thermal fluctuations using a high-capacity internal cold source.

A display panel heat dissipation layer features a non-flat surface with protrusions to increase contact area for improved thermal transfer.

Adjustable convection aperture plates direct cooling air to specific electronic components, resolving the trade-off between adaptability and device complexity.

Segmented pin and flat fins guide refrigerant flow between dual fans, maintaining heat dissipation when one fan fails.

Interconnected ducts guide air to cool powder conveyance units, preventing toner adhesion while reducing structural complexity.

A deformable membrane encapsulates high-thermal-conductivity medium to resolve thermal resistance and package damage risks.

A heat absorbing plate containing a two-phase coolant transfers thermal energy from computing components to rack sidewalls.

Segmented cooling plates with elastic springs decouple thermal management from maintenance access, allowing easy CPU removal without disconnecting heavy hoses.

Compressible fluid in air-spring reducer conduit mitigates pressure changes, reducing insertion force for rigid liquid cooling subsystems.

Segmented thermal pathways conduct heat from components to metal chassis via insulative layers, reducing temperatures by 14°C without fans.

A vehicle display module integrates a rear heat sink with an asymmetric carrier bracket for secure mounting.

A cooling unit uses pressurized airflow through outlet nozzles to amplify air velocity and direct flow toward electronics.

Selective conduit routing simplifies pipeline arrangements and reduces space occupied by complex piping in electronic cooling systems.

Pre-assembled components eliminate manual connection errors while maintaining efficient liquid cooling performance.

Segmenting the cooling tank into distinct liquid layers reduces the volume of expensive two-phase fluid while maintaining high thermal performance.

A curved heat dissipation structure with a substrate gap improves thermal conduction and impact resistance for high-power OLED displays.

Metal base plate circuit carrier connects to housing via friction stir welding for direct fluid cooling contact.

Elevations on the heat sink surface increase contact area within the potting compound, lowering thermal resistance for high-load components.

A single integrated heat transfer device interfaces directly with air and water fluids to reduce thermal resistance.

A liquid immersion cooling apparatus uses a heat insulator between tanks to prevent refrigerant evaporation and maintain volume.

A hybrid cooling unit combines passive and active circuits to manage heat in sealed enclosures.

Isolated shield cavities enable full surface gel application, resolving heat dissipation efficiency trade-offs.

Independent flow adjusters modify channel impedance to resolve the trade-off between cooling system complexity and localized temperature adaptability.

Interleaved front and rear heat spreaders conduct heat laterally to dissipate module temperature while providing EMI shielding.

Integrated refrigeration system merges liquid cooling and air cooling circuits to dissipate heat from high and low generation server components.

A closing member connects directly to refrigerant pipes in an electric power converter.

Vertical circuit board arrangement creates dedicated airflow channels that resolve cooling difficulties in densely packed server units.

A display enclosure uses a fan and air exhaust turret to move air through the housing.

A slim digital signage uses a fan to exhaust heat through a pre-filter and membrane filter.

A spacer with insertion holes distributes screw force to press a circuit board and heat release member uniformly.

A liquid immersion cooling platform uses a pressure controller to manage dielectric fluid vaporization within the vessel.

A modular air duct assembly guides airflow through interchangeable extension pieces.

Segmented refrigerant channels in a power converter cooler match flow rates to module heat loads, resolving uneven cooling performance.

Hermetic sealing segments cabinet interiors into distinct cold and hot plenums, forcing chilled air through computing hardware to eliminate bypass leakage.

Active coolant distribution device uses flow generators to compensate for pressure drops and ensure uniform fluid flow rates across manifold branches.

Orthogonal pipe placement suppresses lateral size expansion while enhancing thermal resistance through optimized refrigerant flow paths.

A trans isomer HFO refrigerant composition transfers heat to electronic components during manufacturing and operation.

An integrated screw pump drives coolant through a liquid cooling module to enhance circulation and heat transfer.

An air plenum piece divides an enclosure into separate volumes to direct cooling airflow over a heat sink.