Cooling/Ventilation/Heating Modifications TRIZ Cases
- Rotatable Monitor Heat Dissipation for Image Capturing Devices
A rotatable monitor exposes heat dissipation fins on an image capturing device casing to enable thermal management.
- Low Profile Cooling Plate with Surrounding Pipeline
A cooling plate accommodates an electronic component in a recessed section surrounded by a thermal pipeline.
- Ceiling-Mounted Server Cooling Ducts for Space Optimization
Ceiling-mounted supply and exhaust air ducts cool server racks without occupying floor space.
- Modular Radar System Architecture for Scalable RF Design
Interchangeable radar modules lower cost and enable rapid reconfiguration without rebuilding the entire system.
- Outdoor Display Cooling via Segmented Airflow and Heat Exchange
Segmented cooling areas with independent sensors adjust airflow direction to prevent sheet wrinkles from temperature deviations.
- Immersion Cooling Systems Using Phase Change Materials
Phase change material maintains constant coolant temperature while liquid-vapor dielectric fluid transfers heat to a condenser for efficient rejection.
- Dual-Cooling Heat Sink for Data Center Overheating
A dual-cooling heat sink combines chilled liquid and forced airflow to remove thermal energy from rack-mounted computing devices.
- Hollow Dummy Device Buoyancy Control in Liquid Immersion Cooling
Preliminary action vents air into a hollow dummy device before removal, reducing buoyancy and preventing rapid flotation while maintaining cooling efficiency.
- Aircraft Electronic Heat Dissipation via Nested Thermal Buffering
Nested housing isolates aircraft electronics from thermal fluctuations using a high-capacity internal cold source.
- Display Panel Heat Dissipation Layer Non-Flat Surface
A display panel heat dissipation layer features a non-flat surface with protrusions to increase contact area for improved thermal transfer.
- Field Customizable Airflow System for Communications Box
Adjustable convection aperture plates direct cooling air to specific electronic components, resolving the trade-off between adaptability and device complexity.
- Electronic Control Device Fan Redundancy Cooling
Segmented pin and flat fins guide refrigerant flow between dual fans, maintaining heat dissipation when one fan fails.
- Ventilation Duct Structural Frame Integration for Toner Adhesion
Interconnected ducts guide air to cool powder conveyance units, preventing toner adhesion while reducing structural complexity.
- Conformable Heat Sink Interface with Deformable Membrane
A deformable membrane encapsulates high-thermal-conductivity medium to resolve thermal resistance and package damage risks.
- Heat Absorbing Plate with Two-Phase Coolant for Rack Cooling
A heat absorbing plate containing a two-phase coolant transfers thermal energy from computing components to rack sidewalls.
- Detachable CPU Cooling Plate With Heat Transfer Springs
Segmented cooling plates with elastic springs decouple thermal management from maintenance access, allowing easy CPU removal without disconnecting heavy hoses.
- Air-Spring Reducer Conduit for Liquid Cooling Insertion
Compressible fluid in air-spring reducer conduit mitigates pressure changes, reducing insertion force for rigid liquid cooling subsystems.
- Conductive Thermal Pathway for Industrial Electronic Module Cooling
Segmented thermal pathways conduct heat from components to metal chassis via insulative layers, reducing temperatures by 14°C without fans.
- Vehicle Display Heat Sink and Asymmetric Mounting Bracket
A vehicle display module integrates a rear heat sink with an asymmetric carrier bracket for secure mounting.
- Cooling Unit with Air Amplification for Radio Remote Units
A cooling unit uses pressurized airflow through outlet nozzles to amplify air velocity and direct flow toward electronics.