Conductive Thermal Pathway for Industrial Electronic Module Cooling
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Solution Overview
Problem
Industrial electronic modules face thermal constraints due to high power dissipation and increased ambient temperatures, where traditional cooling methods like fans are not feasible, and conventional heat sinks are insufficient due to lack of air flow, leading to inadequate heat management.
Innovation Solution
An electronic module installation with a metal chassis and a thermal pathway comprising a chimney, heat channel, and heat output block that conducts heat from electronic components to the chassis, utilizing thermally conductive materials and insulative layers for efficient heat transfer without air flow, allowing for effective heat dissipation without fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks using only convection are used, then the heat dissipation is limited, but the module cooling effectiveness is insufficient due to lack of air flow
Solution Approach 1:
The thermal pathway is segmented into distinct functional components: a chimney structure for heat collection, a heat channel for heat transport, and a heat output block for heat discharge to the chassis. This segmentation allows each component to be optimized for its specific function, with the chimney capturing heat from components, the channel conducting it away, and the output block transferring it to the chassis for dissipation.
Solution Approach 2:
The patent introduces a metal chassis as an intermediary heat sink that serves as a thermal conduit between the electronic components and the external environment. The chassis acts as a mediator that can conduct heat away from the module without requiring internal air flow, effectively bridging the gap between component heat generation and external heat dissipation.
2Temperature
If fans or forced air cooling systems are used, then cooling effectiveness is improved, but reliability decreases due to fan failures and dust contamination
Solution Approach 1:
The system uses the metal chassis itself as the primary cooling mechanism, eliminating the need for external cooling components like fans. The chassis naturally conducts heat away from electronic components through its inherent thermal conductivity, providing a passive, maintenance-free cooling solution that improves reliability by removing moving parts that can fail.
Solution Approach 2:
The patent replaces the mechanical fan-based forced convection system with a passive thermal conduction system using the metal chassis. This substitution eliminates mechanical moving parts, reducing failure points and improving system reliability while maintaining effective heat dissipation through the chassis's thermal properties.
3Temperature
If conduction of heat to module cover is used, then some heat dissipation is achieved, but cooling is insufficient due to lack of air flow around modules
Solution Approach 1:
The metal chassis serves multiple functions simultaneously: it provides structural support for the module installation, acts as an electrical ground reference, and functions as a thermal pathway for heat dissipation. This multi-functionality allows the same component to address mechanical, electrical, and thermal requirements without adding separate cooling structures that would require air flow.
4Temperature
If spacing between modules is increased to improve convection cooling, then heat dissipation improves, but module density decreases
Solution Approach 1:
The patent extracts the heat dissipation function from the air flow environment and transfers it to the metal chassis structure. By taking the heat conduction pathway out of the convective cooling domain and placing it in the conductive cooling domain using the chassis, the design eliminates the need for increased module spacing while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces component temperatures by efficiently conducting heat from electronic components to the chassis, achieving a 14°C temperature reduction in experimental conditions, even at 60°C ambient temperature, while maintaining module installation feasibility and avoiding electrical interference.
Implementation Method 1
The base of the chimney conducts heat from the thermally coupled electronic component into the heat channel
Implementation Method 2
a heat channel thermally connected to the chimney
Implementation Method 3
a heat output block thermally connected to the heat channel. The heat output block conducts heat from the heat channel to the chassis
Implementation Method 4
An electrically insulative non-metallic layer thermally couples the chimney to the electronic component
Data Source
AI summary
An electronic module and chassis/module installation and cooling method are disclosed. The installation comprises a chassis including a metallic heat input region. An electronic module including an electronic component is adapted to be connected to the chassis. An uninterrupted thermal pathway thermally connects the electronic component of the module to the heat input region of the chassis. The thermal pathway comprises a chimney, a heat channel thermally connected to the chimney, and a heat output block thermally connected to the heat channel. A first electrically insulative non-metallic layer thermally couples the chimney to the electronic component. A second electrically insulative non-metallic layer thermally couples the heat output block to the chassis heat input region.