Display Panel Heat Dissipation Layer Non-Flat Surface
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Solution Overview
Problem
Poor heat dissipation in display panels leads to uneven temperature distribution and abnormal display functions, such as prolonged afterimage issues, due to inadequate materials and weak adhesion in the heat dissipation layer.
Innovation Solution
A display panel design featuring a heat dissipation layer with non-flat surfaces and protrusions on one side, increasing the contact area for improved heat transfer, combined with a metal layer and thermally conductive layer for enhanced heat dissipation and electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation layer is provided on the back of the display panel, then heat dissipation function is improved, but if materials are improper or adhesion is weak, heat transfer becomes uneven causing concentrated high temperature
Solution Approach 1:
The patent applies curvature by forming protrusions on the surface of the heat dissipation layer. These protrusions create a non-planar surface that increases contact area with the display panel, improving heat transfer uniformity and preventing concentrated high temperature areas while maintaining effective heat dissipation
2Object-affected harmful factors
If multiple film layers are used to transfer heat from driving chip to copper foil sheet, then electromagnetic shielding is improved, but heat transfer efficiency decreases due to multiple interfaces
Solution Approach 1:
The protrusions on the heat dissipation layer surface improve thermal contact across multiple film layers by creating closer contact points, reducing thermal resistance at interfaces while preserving the multi-layer electromagnetic shielding structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively accelerates heat transfer from the display panel, preventing abnormal functions and extending the device's service life by ensuring uniform heat dissipation and reducing the risk of adhesion issues.
Implementation Method 1
heat generated by a driving chip and a circuit board of the display panel needs to be transferred to the copper foil sheet through multiple film layers in the heat dissipation layer
Implementation Method 2
a surface of the first heat dissipation portion on one side away from the panel main body is a non-flat surface
Data Source
AI summary
The present application provides a display panel and a display device. The display panel includes a panel main body and a heat dissipation layer disposed on one side of the panel main body. The panel main body includes a first body portion. The heat dissipation layer includes a first heat dissipation portion corresponding to the first body portion. A surface of the first heat dissipation portion on one side away from the panel main body is a non-flat surface, so that a contact area of the heat dissipation layer with an outside of the display panel is increased, to avoid display abnormalities on the display panel due to poor heat dissipation.