Conformable Heat Sink Interface with Deformable Membrane
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current thermal management solutions for microelectronics packaging face challenges with uneven thermal contact between heat sinks and IC packages due to low thermal conductivity and conformability, leading to temperature variations and potential damage from high mounting loads.
Innovation Solution
A conformable heat sink interface with a deformable metal or polymer membrane encapsulating a high-thermal-conductivity medium, such as liquid metal or high-k powder, that conforms to non-planar IC packages, ensuring intimate contact and reducing thermal resistance across the package surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If gap pad material is used to provide conformability to non-planar die surfaces, then contact uniformity is improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent uses a composite structure combining a deformable membrane (elastomer or polymer) with embedded high-thermal-conductivity materials such as metal particles, metal matrix composite, or graphite flakes. This composite approach allows the material to simultaneously achieve conformability through the deformable matrix and high thermal conductivity through the embedded conductive materials, resolving the contradiction between contact uniformity and thermal resistance.
Solution Approach 2:
The patent changes the physical state and properties of the thermal interface material by using a deformable membrane that can change shape under compression to conform to non-planar surfaces. The membrane's deformability parameter allows it to adapt to surface irregularities, while the embedded high-k materials maintain thermal conductivity, thus improving contact uniformity without sacrificing thermal performance.
2Stability of the object's composition
If high mounting load is applied to improve thermal contact, then contact pressure is improved, but package damage risk increases
Solution Approach 1:
The patent employs a deformable membrane made of elastomer or polymer that can flex and conform to the die surface under relatively low mounting loads. This flexible membrane structure achieves intimate thermal contact without requiring high compression forces, thereby reducing the risk of package damage while maintaining good thermal contact.
Solution Approach 2:
The deformable membrane changes its physical state under compression, transitioning from a relaxed state to a compressed conforming state. This parameter change allows the material to achieve adequate contact pressure for thermal transfer without requiring externally applied high loads, thus protecting the package from damage.
3Stability of the object's composition
If rigid heat sink interface is used, then structural stability is improved, but conformability to non-planar surfaces deteriorates
Solution Approach 1:
The patent replaces rigid heat sink interfaces with a deformable membrane structure that can flex and adapt to non-planar die surfaces. The membrane's flexibility allows it to conform to surface irregularities while maintaining structural integrity, thus achieving both conformability and structural stability.
Solution Approach 2:
The deformable membrane is constructed as a composite material combining a flexible polymer or elastomer matrix with embedded high-thermal-conductivity materials. This composite structure provides the flexibility needed for conformability while the embedded conductive materials and overall membrane structure maintain sufficient structural stability for thermal management applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient heat transfer with significantly reduced thermal resistance and mounting loads, minimizing the risk of package damage while maintaining high thermal performance across the package surface.
Implementation Method 1
A conformable heat sink interface with a deformable metal or polymer membrane encapsulating a high-thermal-conductivity medium
Implementation Method 2
encapsulating a high-thermal-conductivity medium, such as liquid metal or high-k powder, that conforms to non-planar IC packages, ensuring intimate contact and reducing thermal resistance across the package surface
Data Source
AI summary
A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.