Electronic Control Device Fan Redundancy Cooling
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Solution Overview
Problem
In existing cooling structures for electronic control devices, if one of multiple cooling fans fails, the flow velocity decreases, leading to inadequate distribution of cooling air and potential temperature rises of electronic components.
Innovation Solution
The electronic control device incorporates a base with first and second fans, pin-shaped fins in a first region between the fans, and flat fins in a second region farther from the fans. The pin-shaped fins guide cooling air from one fan towards the other, while the flat fins direct airflow away from the fans.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If pin-shaped fins are provided on almost the entire surface of the casing to maintain heat dissipation properties, then heat dissipation capability is improved, but device complexity increases and the system becomes vulnerable to fan failure
Solution Approach 1:
The heat dissipation fins are segmented into two distinct types: pin-shaped fins in the first region (between the fans) and plate-shaped fins in the second region (peripheral areas). This segmentation allows each region to serve a specific cooling function, optimizing heat dissipation while reducing overall system complexity and vulnerability to fan failure.
Solution Approach 2:
Different fin structures are applied to different regions based on local cooling requirements. The pin-shaped fins provide effective cooling in the high-heat generation area between the fans, while plate-shaped fins handle cooling at the peripheral regions, creating a localized optimization strategy that improves overall heat dissipation efficiency.
2Volume of moving object
If a plurality of small air-cooling fans are fixed on the casing to reduce device size, then device compactness is improved, but reliability decreases when one fan fails
Solution Approach 1:
The cooling system is segmented into multiple independent fan units, each responsible for specific regions. When one fan fails, the other fans continue to operate independently, maintaining partial cooling functionality and thus improving system reliability while keeping the device compact.
Solution Approach 2:
Each fan is positioned to cool specific regions with appropriately designed fin structures. The first fan cools the region with pin-shaped fins, while the second fan cools the region with plate-shaped fins. This localized cooling approach ensures that fan failure does not compromise overall system reliability.
3Temperature
If cooling air is returned toward pin-shaped fins through gap between fins, then heat dissipation efficiency is improved, but flow velocity decreases in downstream region causing insufficient cooling
Solution Approach 1:
The cooling air flow path is segmented into different regions with different fin structures. Pin-shaped fins in the first region efficiently cool the air, while plate-shaped fins in the second region maintain flow velocity and prevent insufficient cooling in downstream regions, creating a staged cooling approach.
Solution Approach 2:
Different fin structures are used in different regions to optimize local cooling performance. The pin-shaped fins provide efficient heat transfer in the first region, while plate-shaped fins in the second region maintain adequate flow velocity, creating a localized optimization that balances heat dissipation efficiency with flow velocity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation even if one fan fails, as the remaining fan can effectively cool the electronic components, and the flat fins improve heat dissipation efficiency.
Implementation Method 1
a first region having a pin-shaped fin that guides a refrigerant sent by one of the first fan and the second fan toward a remaining one of the first fan and the second fan
Implementation Method 2
a second region provided with a plurality of flat fins that guide the refrigerant flowing from the first region to a side away from each of the first fan and the second fan
Implementation Method 3
a base thermally coupled to the electronic component
Implementation Method 4
cooling air, which has been sent from an air-cooling fan and flowed out from a peripheral edge portion of the casing through a gap between the fins for heat dissipation
Data Source
AI summary
An electronic control device includes a base, a first fan and a second fan provided on one surface, a plurality of first heat-dissipating fins provided on the one surface in a first region including a region between first and second fans such that the plurality of first heat-dissipating fins are provided in the region between the first second fans, and a plurality of second heat-dissipating fins provided on the one surface and in a second region. The plurality of first heat-dissipating fins guide a refrigerant sent by one of the first and second fans toward a remaining one of the first and second fans in the first region, and the plurality of second heat-dissipating fins provided in the second region have a structure for guiding a refrigerant flowing in from the first fan or the second fan away from the first fan and the second fan.