Detachable CPU Cooling Plate With Heat Transfer Springs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing heat generation density in information processing devices like servers complicates maintenance and inspection due to the integration of cooling systems, making it difficult to remove and replace CPU units without disconnecting hoses, which are heavy and large in size.
Innovation Solution
The use of a detachable heat generating unit with a cooling plate and heat transfer springs that thermally couple with the CPU unit, allowing for efficient heat dissipation and easy maintenance by providing a lightweight and compact design, where the CPU unit can be removed without disconnecting hoses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the cooling system is integrated with the CPU unit, then heat dissipation efficiency is improved, but maintenance accessibility deteriorates because the CPU unit cannot be removed without disconnecting hoses
Solution Approach 1:
The cooling system is segmented into two independent parts: a cooling plate that remains fixed to the server main body and a CPU unit that can be detached. The cooling plate includes cooling channels and connection ports that stay in the server, while the CPU unit has its own integrated cooling contacts. This segmentation allows the CPU unit to be removed for maintenance without disconnecting any hoses, resolving the contradiction between heat dissipation efficiency and maintenance accessibility.
2Temperature
If hoses are used to connect the cooling system, then heat dissipation is achieved, but the system becomes heavy and large in size
Solution Approach 1:
The flexible hoses are extracted from the cooling system entirely. Instead of using hoses to transport coolant between separate components, the cooling plate integrates cooling channels directly into the server main body structure. The CPU unit connects to the cooling plate through rigid connection ports and contacts, eliminating the need for heavy flexible hoses and reducing overall system weight while maintaining effective heat dissipation.
3Temperature
If the CPU unit is integrated with the cooling plate, then thermal conductivity is improved, but the CPU unit becomes difficult to remove for maintenance
Solution Approach 1:
The connection between the CPU unit and cooling plate is designed to be dynamically adjustable. The CPU unit includes contact plates and connection ports that can be easily engaged with or disengaged from the cooling plate's corresponding contacts and ports. This dynamic connection design maintains strong thermal conductivity when connected while allowing simple detachment for maintenance, resolving the contradiction between thermal conductivity and removability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat transfer and cooling of CPU units, reducing thermal resistance and improving maintenance accessibility by allowing the CPU unit to be easily inserted and removed from the server main body while maintaining effective thermal conductivity.
Implementation Method 1
a thermally conductive portion disposed between a surface of the spring portion on an opposite side from a contact surface of the spring portion that comes into contact with the contact plate, and the cooling plate
Implementation Method 2
a spring portion configured to come into elastic contact with the contact plate
Data Source
AI summary
An information processing device includes: a device main body including a cooling plate; and a heat generating unit including a heat generating element and a contact plate thermally coupled to the heat generating element, the heat generating unit being detachable from the device main body, wherein the cooling plate includes a heat transfer spring configured to come into contact with the contact plate, the heat transfer spring includes a spring portion configured to come into elastic contact with the contact plate, and a thermally conductive portion disposed between a surface of the spring portion on an opposite side from a contact surface of the spring portion that comes into contact with the contact plate, and the cooling plate.