Plasma ALD Upper Electrode Screw Configuration
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Solution Overview
Problem
In atomic layer deposition, the formation of films on substrates is hindered by foreign substances resulting from film peeling off the insulating supporting members in plasma atomic layer deposition apparatuses, leading to film quality deterioration and challenges in maintaining film-forming conditions.
Innovation Solution
The apparatus incorporates a configuration with conductive deposition preventing members and an insulating deposition preventing member to prevent film adhesion on the insulating supporting members, using an inactive gas to inhibit gas infiltration and an attachment structure with non-overlapping screws to minimize film formation on the upper electrode, ensuring effective film formation and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If atomic layer deposition is performed with excellent step coverage, then film uniformity is improved, but film peeling occurs on insulating supporting members causing foreign substances
Solution Approach 1:
The patent extracts and removes the insulating supporting members from the deposition chamber to eliminate the surface where film peeling occurs. By taking out these supporting members that cause harmful film adhesion and subsequent peeling, the source of foreign substances is eliminated while maintaining the benefits of atomic layer deposition on substrates.
Solution Approach 2:
The patent converts the harmful effect of film adhesion on insulating supporting members by changing the electrical properties of these members. By making the supporting members conductive instead of insulating, the film adhesion becomes controlled and predictable, preventing random peeling while maintaining the necessary support function.
2Ease of repair
If deposition preventing plates are used to prevent film adhesion, then maintenance is reduced, but film quality deteriorates due to foreign substances
Solution Approach 1:
The patent removes deposition preventing plates from the system entirely. Instead of using plates that prevent film adhesion (which cause peeling and foreign substances), the invention extracts this function by eliminating the insulating supporting members themselves, thereby eliminating the need for deposition preventing plates and their associated maintenance.
Solution Approach 2:
The patent employs conductive supporting members that can be easily replaced or cleaned without complex maintenance procedures. These conductive members do not require deposition preventing plates, simplifying the system and reducing maintenance while preventing film adhesion issues through their conductive properties rather than physical barriers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances film quality by preventing film adhesion on insulating supporting members and upper electrodes, reducing maintenance requirements and maintaining consistent film-forming conditions, thereby stabilizing the quality of films formed on substrates.
Implementation Method 1
a second electrode (upper electrode) having an opposite surface opposed to the first electrode and generating plasma discharge between the second electrode itself and the first electrode
Data Source
AI summary
A film quality of a film formed on a substrate is improved. A plasma atomic layer deposition apparatus has a lower electrode holding the substrate, and an upper electrode having an opposite surface opposed to the lower electrode and generating plasma discharge between the upper electrode and the lower electrode. Further, the plasma atomic layer deposition apparatus has a conductive deposition preventing member fixed to the opposite surface of the upper electrode by a plurality of screws, and other conductive deposition preventing member fixed to the conductive deposition preventing member by a plurality of others screws. At this time, in a plan view, the plurality of screws and the plurality of other screws are arranged so as not to overlap each other.