Alignment Die Assembly for Optical Interposer Signal Conversion
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Solution Overview
Problem
Existing technologies face challenges in efficiently integrating long-range optical components and short-range electrical components for signal conversion and processing, particularly in devices that combine optical and electrical signaling.
Innovation Solution
The development of an optical interposer that integrates optical and electronic components through a passive alignment process, utilizing a silicon-on-insulator substrate with layered dielectric and conductive materials, and a bonding process to create a dielectric-to-dielectric and metal-to-metal bond, enabling efficient signal transmission and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If optical fibers are used for long-range signal transmission and electrical signals are used for short-range signal transmission and processing, then full-fledged applications with both optical and electrical signaling can be provided, but devices integrating long-range optical components and short-range electrical components become complex
Solution Approach 1:
The device is segmented into distinct optical and electrical sections, with optical components (optical fibers, optical circuits) separated from electrical components (electronic circuits, processors). This segmentation allows each section to be optimized independently while reducing overall integration complexity through modular design.
Solution Approach 2:
An optical-to-electrical converter and electrical-to-optical converter serve as intermediary components that bridge the optical and electrical sections. These converters enable signal conversion between domains, allowing the system to integrate both long-range optical transmission and short-range electrical processing without direct complexity interaction.
2Adaptability or versatility
If optical components and electrical components are integrated in the same device, then full-fledged applications can be provided, but alignment precision requirements increase
Solution Approach 1:
The alignment process is extracted from the final assembly stage and performed separately during manufacturing of individual components. Alignment features are designed and manufactured with precise tolerances independently, then assembled together, reducing the complexity of achieving precise alignment in the final integrated device.
Solution Approach 2:
Alignment features such as alignment marks, positioning structures, and pre-aligned mounting fixtures are prepared in advance during the manufacturing of optical and electrical components. This preliminary alignment preparation ensures that when components are assembled, precise alignment is achieved without requiring complex real-time alignment procedures.
Data Source
AI summary
Optical devices and methods of manufacture are presented in which an alignment die is utilized to provide alignment for a passive optical device. A manufacturing process of one embodiment includes placing an alignment die adjacent to a first optical package; and attaching a first passive optical device to both the alignment die and the first optical package, wherein a first alignment structure of the first passive optical device is conjoined with a second alignment structure of the alignment die.