Coupling Light Guides TRIZ Cases
- Co-Packaged Photonic Engine and Laser Alignment for Low-Loss Optics
Co-packaging a photonic engine and laser die shortens optical paths, removes extra silicon substrates, and improves heat dissipation.
- Fiber Splice Closure Rear Tray for Excess Fiber Management
A pivotable rear tray stores excess fiber with bend control and interlock access, reducing damage and signal loss in splice closures.
- Connector Cage Structure for Insertion-Activated Heat Transfer
A movable cage portion contacts the heat sink during connector insertion, simplifying thermal coupling while saving space and parts.
- Beam Profile Modification Units for Low-Divergence Beam Combining
An array of beam-shaping units expands illumination coverage and cuts aperture truncation, reducing divergence and power loss in beam combining.
- Optical Fiber Joint Structure for Stronger Glass Block Bonding
A large-diameter fiber section with a tapered sloping surface strengthens glass block bonding and diverts reflected light in laser systems.
- Photonic Semiconductor Package for Vertical Waveguide Coupling
Vertical reflectors and interposer waveguides improve optical coupling efficiency and alignment tolerance in compact photonic-electronic packages.
- Integrated Optical Module Assembly for Stable Waveguide Coupling
Metal-layer bonding replaces UV adhesive to improve heat dissipation and alignment stability in integrated optical waveguide modules.
- Distributed Optical Tap Terminals With Hardened Outdoor Connectivity
Sealed daisy-chained optical tap terminals use hardened connectors and gel-sealed ports to improve outdoor durability and simplify installation.
- Sidewall Waveguide Coupler for Photodetector Mode Matching
A tapered sidewall coupler with stacked cores bridges thin waveguides and thick photodetector absorption layers to improve coupling efficiency.
- Glass Via Formation Using Double-Sided Etching to Limit Undercut
Double-sided then single-sided etching reshapes glass vias to reduce undercutting and free opening diameter from substrate thickness.
- Slanted-Incidence Photodetector Structure for Lower Back Reflection
An angled waveguide-to-absorber interface redirects reflected light, improving responsivity and quantum efficiency while lowering dark current.
- Parallel MicroLED Interconnects for Dense Low-Power Chip Links
Parallel microLED and photodetector arrays enable dense chip links with lower power and complexity than laser or electrical interconnects.
- Integrated Optical Interconnect Assembly for PCB Area and Power Reduction
Integrated photonics and electronic dies with micro-lenses, mirrors, and waveguides cut PCB area and power while enabling high-bandwidth links.
- Optical Component Refractive-Index Layout for Emitter-Detector Isolation
A lower-index bulk region isolates adjacent emitter and detector paths, reducing light leakage and cross-talk in compact electronic devices.