Co-Packaged Photonic Engine and Laser Alignment for Low-Loss Optics

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Solution Overview

Problem

Existing technologies face challenges in integrating compact and efficient optical and electrical signal processing systems, particularly in achieving low optical transmission losses and improved thermal dissipation.

Innovation Solution

The integration of a compact universal photonic engine (COUPE) and laser diode through co-package processes, utilizing dielectric-to-dielectric and metal-to-metal bonding, eliminates the need for additional silicon substrates, reduces optical path lengths, and enhances thermal dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If additional silicon substrates are used for integrating optical and electrical components, then device functionality is improved, but device complexity and manufacturing cost increase

Engineering Contradiction:

Improvedevice functionalityVSAvoiddevice complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges optical and electrical signal processing functions onto a single substrate by integrating a photonic integrated circuit (PIC) with electrical components. The PIC includes optical waveguides, modulators, and detectors fabricated on the same substrate as electrical interconnects and processing circuits, eliminating the need for separate optical substrates and reducing overall device complexity while maintaining full functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate is designed to serve multiple functions simultaneously: it acts as both the optical waveguide platform and the electrical circuit substrate. The same substrate material and fabrication processes support both photonic and electronic components, enabling universal functionality without requiring additional specialized substrates.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Productivity

If optical path lengths are increased for signal transmission, then signal processing capability is improved, but optical transmission losses increase

Engineering Contradiction:

Improvesignal processing capabilityVSAvoidoptical transmission losses

Core Design Contradiction:

ProductivityVSLoss of energy

Solution Approach 1:

The patent implements local quality optimization by creating high-index-contrast waveguide structures with laterally confined optical modes. The waveguides feature optimized cross-sectional dimensions and refractive index profiles that concentrate optical energy in small cores, enabling efficient light confinement and low-loss transmission over extended paths while maintaining compact footprint.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent transitions from planar optical paths to three-dimensional waveguide structures with vertical confinement. By utilizing the third dimension for mode confinement through layered heterostructures, the design achieves extended optical path lengths with reduced losses by guiding light through vertically stacked high-index-contrast layers rather than relying solely on lateral propagation.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If thermal dissipation is improved through enhanced heat sinking, then device reliability is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvedevice reliabilityVSAvoidmanufacturing difficulty

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The thermal management function is merged with the structural substrate by incorporating heat sink features directly into the substrate design. The substrate includes integrated thermal vias, heat spreader layers, and thermally conductive pathways that are fabricated using the same semiconductor manufacturing processes as the electronic and photonic devices, enabling efficient heat dissipation without adding separate thermal management components or complex assembly steps.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in increased bump pitch and density, reduced optical transmission losses, and improved thermal dissipation, leading to a more efficient and cost-effective optical and electrical signal processing system.

Implementation Method 1

bonding a laser die over the metallization layers

Methodology Applied

Scientific EffectStimulated emission: Laser

Implementation Method 2

utilizing dielectric-to-dielectric and metal-to-metal bonding

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 3

bonding a first semiconductor die over the metallization layers; bonding a laser die over the metallization layers

Methodology Applied

Scientific EffectDiffusion welding: Diffusion Welding

Data Source

PatentUS20250164690A1Optical device and method of manufacture

Publication Date: 2025.05.22 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Optical devices and methods of manufacture are presented in which metallization layers are formed over a first active layer of first optical components, a first opening is formed through the metallization layers, a first semiconductor die is bonded over the metallization layers, and a laser die is bonded over the metallization layers, wherein after the bonding the laser die a first mirror located within the laser die is aligned with a second mirror through the first opening.