Photonic Semiconductor Package for Vertical Waveguide Coupling

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Solution Overview

Problem

Current technologies face challenges in efficiently integrating optical and electrical signaling and processing within a single device, particularly in achieving effective vertical transmission of optical signals between optical structures.

Innovation Solution

The development of an optical package that includes an optical interposer with photonic components and reflectors, allowing for vertical transmission of optical signals, combined with an electronic die for electrical processing, and the use of lenses for improved signal transmission efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If optical structures are integrated vertically in a compact device, then device compactness is improved, but transmission efficiency between optical structures deteriorates due to alignment difficulties and signal loss over vertical distances

Engineering Contradiction:
Improvedevice compactnessVSAvoidoptical signal transmission efficiency
Core Design Contradiction:
Volume of moving objectVSLoss of energy

Solution Approach 1:

The patent introduces an optical interposer as an intermediary component between the optical component and the electronic die. This interposer includes waveguides that vertically extend through it, providing a dedicated optical transmission path. The waveguides act as mediators that couple the optical component to the electronic die while maintaining efficient signal transmission over the vertical distance, thus resolving the contradiction between device compactness and transmission efficiency.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent transitions from horizontal optical signal transmission to vertical transmission by implementing waveguides that extend vertically through the optical interposer. This dimensional change allows optical signals to be transmitted efficiently in the vertical direction, enabling compact three-dimensional integration while maintaining transmission efficiency. The vertical waveguide configuration resolves the contradiction by utilizing the vertical dimension for both compactness and efficient signal transmission.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If vertical transmission of optical signals is implemented between optical structures, then device integration is improved, but manufacturing precision requirements worsen due to alignment tolerances

Engineering Contradiction:
Improvedevice integrationVSAvoidalignment tolerance
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The optical interposer serves as a mediator that provides pre-formed waveguide structures with defined alignment features. These waveguides are fabricated within the interposer substrate, establishing fixed reference points for alignment. The intermediary structure absorbs the alignment tolerance requirements, allowing the optical component and electronic die to be mounted with relaxed tolerances while maintaining precise optical coupling through the waveguide paths.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The waveguide structures and alignment features are pre-formed within the optical interposer during its fabrication process, before the final assembly of the optical component and electronic die. This preliminary action establishes the alignment references in advance, allowing subsequent assembly steps to proceed with reduced precision requirements. The pre-configured waveguides eliminate the need for high-precision alignment during final device assembly.

Inventive Principle:
Principle #10Preliminary action

3Loss of energy

If lenses are added to improve signal transmission efficiency, then transmission efficiency is improved, but device complexity worsens

Engineering Contradiction:
Improvesignal transmission efficiencyVSAvoiddevice complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The patent integrates the lens functionality directly into the optical interposer structure, merging the focusing element with the waveguide coupling structure. Rather than adding separate lens components, the interposer incorporates optical elements that perform both waveguiding and focusing functions in a unified structure. This merging reduces the number of discrete components and assembly steps, thereby improving transmission efficiency without significantly increasing device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The optical interposer is designed as a multi-functional component that simultaneously provides waveguide transmission, optical focusing, and alignment reference functions. The waveguides serve multiple purposes: transmitting optical signals, providing mechanical support, and establishing alignment references. This multi-functionality reduces the need for additional specialized components, improving signal transmission efficiency while maintaining relatively simple device architecture.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient communication and processing of both optical and electrical signals within a compact device, enhancing transmission efficiency and offset tolerance, while allowing for longer vertical distances between optical structures.

Implementation Method 1

the reflector configured to receive light from the photonic component and reflect the received light vertically through the dielectric layers

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

a lens attached to the optical package and configured to transmit light from the reflector

Methodology Applied
Scientific EffectRefraction: Refraction

Data Source

PatentUS20250123449A1Photonic semiconductor package and method of forming the same
Publication Date: 2025.04.17 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250123449A1 patent drawing
  • US20250123449A1 patent drawing
  • US20250123449A1 patent drawing

AI summary

A package includes an interposer, wherein the interposer includes a first waveguide and a first reflector that is optically coupled to the first waveguide; an optical package attached to the interposer, wherein the optical package includes a second waveguide; and a second reflector that is optically coupled to the second waveguide, wherein the second reflector is vertically aligned with the first reflector.