Parallel MicroLED Interconnects for Dense Low-Power Chip Links
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optical interconnects for high-performance computing and networking face challenges such as increased power usage and complexity, especially at higher clock rates, and are inefficient at high temperatures encountered in intra- and inter-chip interconnects.
Innovation Solution
The use of microLEDs in parallel microLED interconnects (PMIs) for short-distance data communications, which involve arrays of transmitters and receivers connected by a propagation medium, such as waveguides or fibers, to facilitate low-power, high-density, and cost-effective data connections between ICs and modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If lasers are used for optical communications, then long range fiber optic communications are achieved, but high drive power and large size are required
Solution Approach 1:
The patent replaces traditional lasers with microLEDs that are smaller, consume less power, and can operate at high temperatures. The microLEDs are described as 'small,' 'low power,' and capable of operating at 'high temperatures encountered in intra-chip and inter-chip interconnects,' directly addressing the contradictions of size and power consumption while maintaining optical communication functionality.
2Productivity
If transistor dimensions are shrunk to increase transistor counts, then IC performance and cost improvements are achieved, but data communication power usage and complexity increase
Solution Approach 1:
The patent substitutes electrical signal transmission with optical signal transmission using microLEDs and photodetectors. This optical interconnect approach replaces traditional electrical communication pathways, enabling faster data transmission with reduced power consumption and heat generation, thereby resolving the contradiction between communication speed and power usage in high-transistor-count ICs.
3Area of stationary object
If IC chips are co-packaged within a single module to increase density, then space efficiency is improved, but communication power demands and complexity between chips increase
Solution Approach 1:
The patent implements a universal optical interconnect platform using microLEDs and photodetectors that can be integrated across multiple chips within a module. This unified optical communication approach simplifies inter-chip communication by providing a standardized, low-power interface that works across different chip types and distances, reducing the overall complexity of co-packaged module designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables fast, low-power, dense, and low-cost data connections, reducing power consumption and complexity while maintaining high performance across various interconnect levels, from intra-chip to inter-module connections.
Implementation Method 1
the optical connections, which may be termed optical interconnects, use one or more microLEDs to generate light used to transfer information
Implementation Method 2
a receiver comprises receiver light collection optics, a photodetector, and receiver circuitry
Data Source
AI summary
MicroLEDs may be used in providing intra-chip optical communications and/or inter-chip optical communications, for example within a multi-chip module or semiconductor package containing multiple integrated circuit semiconductor chips. In some embodiments the integrated circuit semiconductor chips may be distributed across different shelves in a rack. The optical interconnections may make use of optical couplings, for example in the form of lens(es) and/or mirrors. In some embodiments arrays of microLEDs and arrays of photodetectors are used in providing parallel links, which in some embodiments are duplex links.