Integrated Optical Interconnect Assembly for PCB Area and Power Reduction
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Solution Overview
Problem
Current board-level optical interconnects in server systems are inefficient in terms of area and power consumption due to the use of discrete electronic and photonics dies, requiring large Serializer/Deserializer blocks and discrete fiber cables, which hinder integration with PCBs.
Innovation Solution
Integration of electronic and photonics dies with a substrate, socket, and micro-lenses to form waveguides and fiber connections, utilizing silicon-on-insulator chips and polymer materials for low-cost, high-density optical coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete electronic dies and discrete photonics dies are assembled on a PCB with discrete fiber cables, then optical interconnect functionality is achieved, but area consumption and power consumption increase significantly
Solution Approach 1:
The patent merges discrete electronic dies, photonics dies, and fiber cable connections into an integrated optical interconnect assembly that is directly mounted on the PCB. This integration eliminates the need for separate discrete components and their associated routing infrastructure, thereby reducing board area consumption while maintaining full optical interconnect functionality.
Solution Approach 2:
The integrated optical interconnect assembly serves multiple functions simultaneously: it provides electronic signal processing, optical signal generation/detection, and physical fiber coupling all within a single consolidated structure. This multi-functionality replaces what previously required multiple separate components, reducing overall area usage.
2Reliability
If discrete electronic dies and discrete photonics dies are assembled on a PCB with discrete fiber cables, then optical interconnect functionality is achieved, but power consumption increases due to large Serializer/Deserializer blocks
Solution Approach 1:
By integrating the photonics die directly with the electronic die in close proximity, the patent enables shorter electrical interconnects and reduces the need for large Serializer/Deserializer blocks. This integration maintains optical functionality while reducing the power consumption associated with signal conditioning and conversion circuits.
3Reliability
If discrete fiber cables are used for coupling, then optical signal transmission is achieved, but integration with PCB is hindered
Solution Approach 1:
The patent merges the fiber cable coupling function directly into the optical interconnect assembly by integrating fiber adapters and coupling mechanisms with the photonics die. This consolidation simplifies PCB integration by providing a single self-contained module that handles both optical signal generation and physical fiber coupling, eliminating the need for separate fiber routing and connection management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration method reduces area and power consumption while enabling high-bandwidth data transfers exceeding 100 Gb/sec, improving efficiency and performance of optical interconnects.
Implementation Method 1
at least one first micro-lens formed beneath the photonics die; at least one second micro-lens formed on top of the board, wherein the at least one first micro-lens and the at least one second micro-lens are optically coupled
Implementation Method 2
at least one first micro-lens formed beneath the photonics die; at least one second micro-lens formed on top of the board
Implementation Method 3
at least one mirror installed on top of the board and optically aligned to the at least one second micro-lens and optically aligned to the at least one waveguide
Implementation Method 4
at least one waveguide formed in the socket or board
Data Source
AI summary
Disclosed are apparatus and methods for optical interconnections that include the integration of a photonics die (pDie) and an electronic die (eDie) with a socket layer, waveguides and fiber connectors to enable high bandwidth communications. In one embodiment, an exemplary optical interconnect device includes an electronic die coupled to a photonics die and integrated with a substrate, a socket, a board, a pair of micro-lenses and a mirror coupled to a waveguide, which can be embedded in the board. In another embodiment, the waveguide is embedded in a socket layer and coupled to a fiber connector. In these embodiments, the exemplary optical interface device can be coupled one more other optical interconnect devices via a waveguide array and/or a fiber array.